APA (7th ed.) Citation

NISHIGUCHI, T., MASUDA, M., SASAKI, H., & OOKAWA, T. (2006). A Decreasing Mechanism of the Removal Rate in Wafer Polishing Process. Journal of the Japan Society for Precision Engineering, Contributed Papers, 72(4), 517-522. https://doi.org/10.2493/jspe.72.517

Chicago Style (17th ed.) Citation

NISHIGUCHI, Takashi, Masami MASUDA, Hirotaka SASAKI, and Tetsuo OOKAWA. "A Decreasing Mechanism of the Removal Rate in Wafer Polishing Process." Journal of the Japan Society for Precision Engineering, Contributed Papers 72, no. 4 (2006): 517-522. https://doi.org/10.2493/jspe.72.517.

MLA (9th ed.) Citation

NISHIGUCHI, Takashi, et al. "A Decreasing Mechanism of the Removal Rate in Wafer Polishing Process." Journal of the Japan Society for Precision Engineering, Contributed Papers, vol. 72, no. 4, 2006, pp. 517-522, https://doi.org/10.2493/jspe.72.517.