Removal of Post-dry Etch Residue uing Ultra Low Environmental Load Technique

• Published in: ECS transactions Vol. 25; no. 5; pp. 249 - 256
• Main Authors: Hayashida, Atsushi, Seki, Akiko, Mashiko, Takashi, Sanada, Toshiyuki, Watanabe, Masao
• Format: Journal Article
• Language: English
• Published: 25.09.2009

A novel ultra low environmental load removal technique of post-dry etch residue is developed, by applying physical force cleaning technique using high-speed steam-water mixture spray. It is found that the removal rate of the proposed technique depends on the dry-etch processes, and that the steam-wa...