Silk-Aloe Vera Composite Piezoelectric Film: A New Paradigm in Eco- Friendly Piezoelectrics

Piezoelectric materials derived from biological sources are given greater consideration in the present era due to their advantages, such as biocompatibility, sustainability, and potential for tailoring properties through chemical modification and genetic engineering. Silk, a bio-piezopolymer, derive...

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Published inIEEE journal on flexible electronics Vol. 3; no. 7; pp. 292 - 299
Main Authors Bhagavathi, K. Aditya, Bonam, Satish, Joseph, Jose, Rao, Karri Trinadha, Singh, Shiv Govind, Vanjari, Siva Rama Krishna
Format Journal Article
LanguageEnglish
Published IEEE 01.07.2024
Subjects
Crystals
Electrical engineering
Flexible pressure sensor
Motion pictures
Optical fiber sensors
piezoelectric
piezoforce microscopy (PFM)
Pressure sensors
silk-aloe vera (SAV) composite
Surface morphology
Sustainable development
Online AccessGet full text
ISSN2768-167X
2768-167X
DOI10.1109/JFLEX.2024.3425812

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Abstract Piezoelectric materials derived from biological sources are given greater consideration in the present era due to their advantages, such as biocompatibility, sustainability, and potential for tailoring properties through chemical modification and genetic engineering. Silk, a bio-piezopolymer, derived from the silk glands of various species of silkworms, is extensively studied for its piezoelectric properties and applications thereof. This article presents the development of a composite bio-piezopolymer, amalgamating the material properties of silk and the extracts taken from a tropical desert plant, aloe vera. A comprehensive material characterization protocol is embraced to assess the performance of the thin film formed from the silk-aloe vera (SAV) composite solution. In addition to an improvement in the piezoelectric characteristics, the composite film exhibited excellent surface uniformity and crystallinity, proving its potential for real-time applications. Pressure sensors were fabricated with SAV composite films and characterized using a custom-built test setup. The characterization results surpassed the performance achieved by pressure sensors fabricated using only silk thin film.
AbstractList Piezoelectric materials derived from biological sources are given greater consideration in the present era due to their advantages, such as biocompatibility, sustainability, and potential for tailoring properties through chemical modification and genetic engineering. Silk, a bio-piezopolymer, derived from the silk glands of various species of silkworms, is extensively studied for its piezoelectric properties and applications thereof. This article presents the development of a composite bio-piezopolymer, amalgamating the material properties of silk and the extracts taken from a tropical desert plant, aloe vera. A comprehensive material characterization protocol is embraced to assess the performance of the thin film formed from the silk-aloe vera (SAV) composite solution. In addition to an improvement in the piezoelectric characteristics, the composite film exhibited excellent surface uniformity and crystallinity, proving its potential for real-time applications. Pressure sensors were fabricated with SAV composite films and characterized using a custom-built test setup. The characterization results surpassed the performance achieved by pressure sensors fabricated using only silk thin film.
Author Vanjari, Siva Rama Krishna
Joseph, Jose
Rao, Karri Trinadha
Bhagavathi, K. Aditya
Bonam, Satish
Singh, Shiv Govind
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Cites_doi 10.1039/d1ra03557f
10.1007/s42398-019-00092-y
10.1109/LSENS.2023.3331725
10.1016/j.nanoen.2017.10.041
10.1088/1361-665x/ac9ffa
10.1515/gps-2019-0007
10.1109/MEMS49605.2023.10052501
10.1016/j.nanoen.2020.104767
10.1016/j.mtsust.2022.100230
10.1109/FLEPS49123.2020.9239575
10.1109/ISCAS48785.2022.9937999
10.3390/s18113605
10.3390/polym13244327
10.1016/b978-0-323-91677-6.00021-0
10.1080/00405000.2016.1167391
10.1143/JJAP.3.117
10.1093/iti/liad014
10.1088/1361-665X/aa5d99
10.1002/cphc.202100279
10.1016/j.enconman.2022.115272
10.1088/0964-1726/23/3/033001
10.1088/0022-3727/44/46/464003
10.1016/j.sna.2019.111789
10.1109/icsens.2016.7808838
10.1038/s41378-021-00261-2
10.1109/TUFFC.2006.169
10.1016/j.carbpol.2018.09.001
10.1109/jsen.2017.2766163
10.1109/JSEN.2023.3294644
10.1080/09506608.2021.1915935
10.1002/aenm.202100698
10.1063/1.4748575
10.1002/adfm.201002077
10.1557/mrs2009.176
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References ref13
ref12
ref34
ref15
ref14
ref31
ref30
ref11
ref33
ref10
ref32
ref2
ref1
ref17
ref16
ref19
ref18
ref24
ref23
ref26
ref25
ref20
ref22
ref21
ref28
ref27
ref29
ref8
ref7
ref9
ref4
ref3
ref6
ref5
References_xml – ident: ref16
  doi: 10.1039/d1ra03557f
– ident: ref1
  doi: 10.1007/s42398-019-00092-y
– ident: ref27
  doi: 10.1109/LSENS.2023.3331725
– ident: ref14
  doi: 10.1016/j.nanoen.2017.10.041
– ident: ref33
  doi: 10.1088/1361-665x/ac9ffa
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  doi: 10.1515/gps-2019-0007
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  doi: 10.1109/MEMS49605.2023.10052501
– ident: ref15
  doi: 10.1016/j.nanoen.2020.104767
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  doi: 10.1016/j.mtsust.2022.100230
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  doi: 10.1109/FLEPS49123.2020.9239575
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  doi: 10.1109/ISCAS48785.2022.9937999
– ident: ref34
  doi: 10.3390/s18113605
– ident: ref11
  doi: 10.3390/polym13244327
– ident: ref10
  doi: 10.1016/b978-0-323-91677-6.00021-0
– ident: ref23
  doi: 10.1080/00405000.2016.1167391
– ident: ref12
  doi: 10.1143/JJAP.3.117
– ident: ref3
  doi: 10.1093/iti/liad014
– ident: ref8
  doi: 10.1088/1361-665X/aa5d99
– ident: ref18
  doi: 10.1002/cphc.202100279
– ident: ref4
  doi: 10.1016/j.enconman.2022.115272
– ident: ref5
  doi: 10.1088/0964-1726/23/3/033001
– ident: ref29
  doi: 10.1088/0022-3727/44/46/464003
– ident: ref32
  doi: 10.1016/j.sna.2019.111789
– ident: ref21
  doi: 10.1109/icsens.2016.7808838
– ident: ref19
  doi: 10.1038/s41378-021-00261-2
– ident: ref28
  doi: 10.1109/TUFFC.2006.169
– ident: ref13
  doi: 10.1016/j.carbpol.2018.09.001
– ident: ref17
  doi: 10.1109/jsen.2017.2766163
– ident: ref24
  doi: 10.1109/JSEN.2023.3294644
– ident: ref9
  doi: 10.1080/09506608.2021.1915935
– ident: ref2
  doi: 10.1002/aenm.202100698
– ident: ref7
  doi: 10.1063/1.4748575
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  doi: 10.1002/adfm.201002077
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  doi: 10.1557/mrs2009.176
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SubjectTerms Crystals
Electrical engineering
Flexible pressure sensor
Motion pictures
Optical fiber sensors
piezoelectric
piezoforce microscopy (PFM)
Pressure sensors
silk-aloe vera (SAV) composite
Surface morphology
Sustainable development
Title Silk-Aloe Vera Composite Piezoelectric Film: A New Paradigm in Eco- Friendly Piezoelectrics
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