Directed Assembly of p-Type Tellurium Nanowires for Room-Temperature-Processed Thin-Film Transistors

The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable thin-film transistors (TFTs) and circuits. However, uniformity and scalability remain the main hindrances for solution-processed devices, especia...

Full description

Saved in:
Bibliographic Details
Published inIEEE journal on flexible electronics Vol. 3; no. 10; pp. 454 - 460
Main Authors Hadhi Pazhaya Puthanveettil, Mohammed, Singh, Manvendra, Chandana Amarakonda, Siri, Dasgupta, Subho
Format Journal Article
LanguageEnglish
Published IEEE 01.10.2024
Subjects
Online AccessGet full text
ISSN2768-167X
2768-167X
DOI10.1109/JFLEX.2025.3526083

Cover

Abstract The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable thin-film transistors (TFTs) and circuits. However, uniformity and scalability remain the main hindrances for solution-processed devices, especially when it comes to the deposition of nanomaterials. In this regard, directional assembly using dielectrophoresis is a quick and easy way to uniformly align 1-D nanostructures, for example, nanowires, to bridge a gap between the electrodes to form a transistor channel using nonlinear ac electric fields. In this study, high-hole mobility tellurium nanowires are assembled using nonlinear ac dielectrophoresis to fabricate electrolyte-gated TFTs (EG-TFTs) on a flexible substrate at room temperature. These p-type flexible transistors exhibit an on-off ratio of <inline-formula> <tex-math notation="LaTeX">3.3\times 10^{2} </tex-math></inline-formula>, an ON-current density of 20 <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>A <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>m−1, a specific transconductance of 8.5 <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>S <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>m−1, and linear mobility of 20.6 cm2 V−1 s−1 with adequate mechanical strain tolerance.
AbstractList The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable thin-film transistors (TFTs) and circuits. However, uniformity and scalability remain the main hindrances for solution-processed devices, especially when it comes to the deposition of nanomaterials. In this regard, directional assembly using dielectrophoresis is a quick and easy way to uniformly align 1-D nanostructures, for example, nanowires, to bridge a gap between the electrodes to form a transistor channel using nonlinear ac electric fields. In this study, high-hole mobility tellurium nanowires are assembled using nonlinear ac dielectrophoresis to fabricate electrolyte-gated TFTs (EG-TFTs) on a flexible substrate at room temperature. These p-type flexible transistors exhibit an on-off ratio of <inline-formula> <tex-math notation="LaTeX">3.3\times 10^{2} </tex-math></inline-formula>, an ON-current density of 20 <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>A <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>m−1, a specific transconductance of 8.5 <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>S <inline-formula> <tex-math notation="LaTeX">\mu </tex-math></inline-formula>m−1, and linear mobility of 20.6 cm2 V−1 s−1 with adequate mechanical strain tolerance.
Author Hadhi Pazhaya Puthanveettil, Mohammed
Singh, Manvendra
Dasgupta, Subho
Chandana Amarakonda, Siri
Author_xml – sequence: 1
  givenname: Mohammed
  orcidid: 0009-0007-8707-1205
  surname: Hadhi Pazhaya Puthanveettil
  fullname: Hadhi Pazhaya Puthanveettil, Mohammed
  organization: Department of Materials Engineering, Indian Institute of Science (IISc), Bengaluru, India
– sequence: 2
  givenname: Manvendra
  orcidid: 0009-0002-9985-8148
  surname: Singh
  fullname: Singh, Manvendra
  organization: Department of Materials Engineering, Indian Institute of Science (IISc), Bengaluru, India
– sequence: 3
  givenname: Siri
  orcidid: 0009-0007-0288-4478
  surname: Chandana Amarakonda
  fullname: Chandana Amarakonda, Siri
  organization: Department of Materials Engineering, Indian Institute of Science (IISc), Bengaluru, India
– sequence: 4
  givenname: Subho
  orcidid: 0000-0002-3952-2952
  surname: Dasgupta
  fullname: Dasgupta, Subho
  email: dasgupta@iisc.ac.in
  organization: Department of Materials Engineering, Indian Institute of Science (IISc), Bengaluru, India
BookMark eNpNkF1LwzAUhoNMcM79AfEifyAzH2uSXo65TWWoSIXdlTQ9wUrblKRD9u_t3C52dV447_NePLdo1PoWELpndMYYTR9f19vVbsYpT2Yi4ZJqcYXGXElNmFS70UW-QdMYfyilPJVMaDpG5VMVwPZQ4kWM0BT1AXuHO5IdOsAZ1PU-VPsGv5nW_w7NiJ0P-NP7hmTQdBBMvw9APoK3MPAlzr6rlqyrusFZMG2sYu9DvEPXztQRpuc7QV_rVbZ8Jtv3zctysSWWiXlPDFeuAJpYKIwE6wrNtCs5JAxEkdK5YlanJi1UUiaacQOKGsmHpy1S6YQVE8RPuzb4GAO4vAtVY8IhZzQ_qsr_VeVHVflZ1QA9nKAKAC4AzedKc_EHsl5pyQ
CODEN IJFEBL
Cites_doi 10.1039/d0nr04537c
10.1109/JFLEX.2023.3278234
10.1002/adfm.202310264
10.1039/b313938g
10.1126/sciadv.adm9322
10.1002/adfm.202316375
10.1021/la053021l
10.1038/nnano.2010.106
10.1038/s41928-020-0365-4
10.1038/s41928-023-00971-7
10.1109/TED.2021.3050432
10.1002/admi.202200949
10.1021/acs.jpcc.2c05632
10.1002/aelm.202101331
10.1021/la063272+
10.1038/s41427-021-00314-y
10.1038/s41586-023-05889-w
10.1038/s41578-024-00661-6
10.1038/s41928-022-00712-2
10.1039/C8CS00598B
10.1038/s41566-022-00999-9
10.1038/s41467-022-35777-2
10.1038/ncomms7269
10.1002/adma.202209906
10.1021/acsnano.3c06972
10.1038/s41586-022-05592-2
10.1002/aelm.202200528
10.1002/advs.202001116
10.1038/s41598-019-55031-y
10.1021/acsami.6b10939
10.1021/cm020587b
10.1109/TED.2014.2320553
10.1109/TBME.2022.3183167
10.1002/adfm.201200951
10.1002/admt.202300256
10.1038/ncomms5147
10.1021/nl900423g
10.1126/sciadv.abb5898
10.1039/D0NR04156D
10.1002/smtd.202100634
10.1039/C7CS00013H
10.1002/smll.202202891
10.1002/elps.202000137
10.1021/acsnano.5b07506
10.1021/acsnano.2c07910
10.1088/1361-6528/aab7a2
10.1021/acsnano.6b07190
10.1002/aelm.202000788
10.1016/j.jallcom.2016.08.246
ContentType Journal Article
DBID 97E
RIA
RIE
AAYXX
CITATION
DOI 10.1109/JFLEX.2025.3526083
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005-present
IEEE All-Society Periodicals Package (ASPP) 1998-Present
IEEE Electronic Library (IEL)
CrossRef
DatabaseTitle CrossRef
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE/IET Electronic Library
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISSN 2768-167X
EndPage 460
ExternalDocumentID 10_1109_JFLEX_2025_3526083
10824782
Genre orig-research
GrantInformation_xml – fundername: Science and Engineering Research Board (SERB), India
  grantid: EMR/2016/006980
  funderid: 10.13039/501100001843
– fundername: Anusandhan National Research Foundation (ANRF)
  grantid: CRG/2023/003983
  funderid: 10.13039/501100001321
GroupedDBID 0R~
97E
AASAJ
AAWTH
ABJNI
ABQJQ
ABVLG
AGQYO
AHBIQ
AKJIK
AKQYR
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
EBS
IFIPE
JAVBF
OCL
RIA
RIE
AAYXX
CITATION
ID FETCH-LOGICAL-c134t-a27fbe05ceba6ecfb818fd2e51e3b90471c89a9b75d5812ae70a621e3cb96f3c3
IEDL.DBID RIE
ISSN 2768-167X
IngestDate Tue Jul 01 03:01:03 EDT 2025
Wed Aug 27 01:53:40 EDT 2025
IsPeerReviewed false
IsScholarly true
Issue 10
Language English
License https://ieeexplore.ieee.org/Xplorehelp/downloads/license-information/IEEE.html
https://doi.org/10.15223/policy-029
https://doi.org/10.15223/policy-037
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c134t-a27fbe05ceba6ecfb818fd2e51e3b90471c89a9b75d5812ae70a621e3cb96f3c3
ORCID 0000-0002-3952-2952
0009-0007-8707-1205
0009-0002-9985-8148
0009-0007-0288-4478
PageCount 7
ParticipantIDs crossref_primary_10_1109_JFLEX_2025_3526083
ieee_primary_10824782
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2024-Oct.
PublicationDateYYYYMMDD 2024-10-01
PublicationDate_xml – month: 10
  year: 2024
  text: 2024-Oct.
PublicationDecade 2020
PublicationTitle IEEE journal on flexible electronics
PublicationTitleAbbrev JFLEX
PublicationYear 2024
Publisher IEEE
Publisher_xml – name: IEEE
References ref13
ref12
ref15
ref14
ref11
ref10
ref17
ref16
ref19
Lings (ref43) 1971; 4
ref18
ref50
ref46
ref45
ref48
ref47
ref42
ref41
ref44
ref49
ref8
ref7
ref9
ref4
ref3
ref6
ref5
ref40
ref35
ref34
ref37
ref36
ref31
ref30
ref33
ref32
ref2
ref1
ref39
ref38
ref24
ref23
ref26
ref25
ref20
ref22
ref21
ref28
ref27
ref29
References_xml – ident: ref4
  doi: 10.1039/d0nr04537c
– ident: ref11
  doi: 10.1109/JFLEX.2023.3278234
– ident: ref28
  doi: 10.1002/adfm.202310264
– ident: ref38
  doi: 10.1039/b313938g
– ident: ref25
  doi: 10.1126/sciadv.adm9322
– ident: ref29
  doi: 10.1002/adfm.202316375
– ident: ref41
  doi: 10.1021/la053021l
– ident: ref33
  doi: 10.1038/nnano.2010.106
– ident: ref42
  doi: 10.1038/s41928-020-0365-4
– ident: ref6
  doi: 10.1038/s41928-023-00971-7
– ident: ref12
  doi: 10.1109/TED.2021.3050432
– ident: ref49
  doi: 10.1002/admi.202200949
– ident: ref39
  doi: 10.1021/acs.jpcc.2c05632
– ident: ref24
  doi: 10.1002/aelm.202101331
– ident: ref44
  doi: 10.1021/la063272+
– ident: ref23
  doi: 10.1038/s41427-021-00314-y
– ident: ref34
  doi: 10.1038/s41586-023-05889-w
– ident: ref9
  doi: 10.1038/s41578-024-00661-6
– ident: ref17
  doi: 10.1038/s41928-022-00712-2
– ident: ref22
  doi: 10.1039/C8CS00598B
– ident: ref8
  doi: 10.1038/s41566-022-00999-9
– ident: ref32
  doi: 10.1038/s41467-022-35777-2
– ident: ref15
  doi: 10.1038/ncomms7269
– ident: ref2
  doi: 10.1002/adma.202209906
– ident: ref19
  doi: 10.1021/acsnano.3c06972
– ident: ref18
  doi: 10.1038/s41586-022-05592-2
– ident: ref20
  doi: 10.1002/aelm.202200528
– ident: ref1
  doi: 10.1002/advs.202001116
– ident: ref46
  doi: 10.1038/s41598-019-55031-y
– volume: 4
  start-page: 356
  issue: 2
  year: 1971
  ident: ref43
  article-title: High-purity Hf. Raman spectra and lattice dynamics of tellurium
  publication-title: Phys. Soc.
– ident: ref36
  doi: 10.1021/acsami.6b10939
– ident: ref40
  doi: 10.1021/cm020587b
– ident: ref10
  doi: 10.1109/TED.2014.2320553
– ident: ref31
  doi: 10.1109/TBME.2022.3183167
– ident: ref35
  doi: 10.1002/adfm.201200951
– ident: ref47
  doi: 10.1002/admt.202300256
– ident: ref14
  doi: 10.1038/ncomms5147
– ident: ref45
  doi: 10.1021/nl900423g
– ident: ref13
  doi: 10.1126/sciadv.abb5898
– ident: ref26
  doi: 10.1039/D0NR04156D
– ident: ref50
  doi: 10.1002/smtd.202100634
– ident: ref21
  doi: 10.1039/C7CS00013H
– ident: ref48
  doi: 10.1002/smll.202202891
– ident: ref30
  doi: 10.1002/elps.202000137
– ident: ref7
  doi: 10.1021/acsnano.5b07506
– ident: ref27
  doi: 10.1021/acsnano.2c07910
– ident: ref37
  doi: 10.1088/1361-6528/aab7a2
– ident: ref3
  doi: 10.1021/acsnano.6b07190
– ident: ref16
  doi: 10.1002/aelm.202000788
– ident: ref5
  doi: 10.1016/j.jallcom.2016.08.246
SSID ssj0002961380
Score 2.2694435
Snippet The flexible electronics domain has emerged as an alternate technology beyond silicon CMOS because of advancements in low-temperature solution-processable...
SourceID crossref
ieee
SourceType Index Database
Publisher
StartPage 454
SubjectTerms Assembly
Dielectrophoresis
Electric fields
Electrodes
electrolyte gating
Flexible electronics
inkjet printing
Nanowires
Substrates
Tellurium
Thin film transistors
thin-film transistor (TFT)
Transistors
Title Directed Assembly of p-Type Tellurium Nanowires for Room-Temperature-Processed Thin-Film Transistors
URI https://ieeexplore.ieee.org/document/10824782
Volume 3
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LSwMxEA7akx58VqwvcvAmqWn2maNISynag7TQ25JkJ1Bsu6XtHvTXO8lupQqCt2VfhGSS78tk5htC7tMcSQEEhgUKp1sYc8tSYS0TkFpuQqc34vyQr8O4Pw4Hk2hSJ6v7XBgA8MFn0HaX_iw_L0zpXGU4w1MRIqTtk320sypZ69uhIiQiU8q3iTFcPg56L90JbgFF1HYq8DwNfoDPTjUVDya9YzLcNqOKIXlvlxvdNp-_FBr_3c4TclTTSvpU2cEp2YPFGTncERs8J3m1ukFO3UHvXM8-aGHpkrmdKB3BbFaupuWc4nJbOP3iNUU6S9-QV7MRILeutJdZnViAf3EVP1lvOptTj3debmTdJONed_TcZ3WNBWY6QbhhSiRWA48MaBWDsRoB3OYCog4EWnKELpNKJXUS5RFyAQUJV7HAh0bL2AYmuCCNRbGAS0K10IBkIAYZq1Bz0DqJc8sBCWmilAxa5GHb-dmyktLI_BaEy8wPVeaGKquHqkWarmN33qz69OqP-9fkAD8Pqzi7G9LYrEq4Rb6w0XfeTr4AQkK_0w
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV1LSwMxEA5aD-rBZ8W3OXiT1DT7zFGkpdbag1TobUmyExD7onYP-uudZLdSBcHbsruEkEnyfZPMfEPIdZojKYDAsEDhcgtjblkqrGUCUstN6PRG3DnkUz_uvITdYTSsktV9LgwA-OAzaLhHf5efT03hjspwhaciREhbJxsI_GFUpmt9H6kIidiU8mVqDJe33XavNUQnUEQNpwPP0-AH_KzUU_Fw0t4l_WVHyiiSt0ax0A3z-Uuj8d893SM7FbGkd-VM2CdrMDkg2ytyg4ckL_c3yKm76h3r0QedWjpjzhelAxiNivlrMaa44U6dgvE7RUJLn5FZswEguy7Vl1mVWoCtuJqfrP06GlOPeF5w5L1OXtqtwX2HVVUWmGkG4YIpkVgNPDKgVQzGaoRwmwuImhBoyRG8TCqV1EmUR8gGFCRcxQI_Gi1jG5jgiNQm0wkcE6qFBqQDMchYhZqD1kmcWw5ISROlZHBCbpaDn81KMY3MOyFcZt5UmTNVVpnqhNTdwK78WY7p6R_vr8hmZ_DUy3oP_cczsoVNhWXU3TmpLeYFXCB7WOhLP2e-AHezwyA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Directed+Assembly+of+p-Type+Tellurium+Nanowires+for+Room-Temperature-Processed+Thin-Film+Transistors&rft.jtitle=IEEE+journal+on+flexible+electronics&rft.au=Hadhi+Pazhaya+Puthanveettil%2C+Mohammed&rft.au=Singh%2C+Manvendra&rft.au=Chandana+Amarakonda%2C+Siri&rft.au=Dasgupta%2C+Subho&rft.date=2024-10-01&rft.issn=2768-167X&rft.eissn=2768-167X&rft.volume=3&rft.issue=10&rft.spage=454&rft.epage=460&rft_id=info:doi/10.1109%2FJFLEX.2025.3526083&rft.externalDBID=n%2Fa&rft.externalDocID=10_1109_JFLEX_2025_3526083
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=2768-167X&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=2768-167X&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=2768-167X&client=summon