Jeong, S., Lee, S. H., Shin, J. W., & Lee, Y. M. (2024). P‐169: Study on the Behavior of Adhesive Cohesive Properties According to Cyclic Test of Foldable Products. SID International Symposium Digest of technical papers, 55(1), 2029-2032. https://doi.org/10.1002/sdtp.17997
Chicago Style (17th ed.) CitationJeong, SeongYun, Seon Hyeon Lee, Jae Won Shin, and Yun Mi Lee. "P‐169: Study on the Behavior of Adhesive Cohesive Properties According to Cyclic Test of Foldable Products." SID International Symposium Digest of Technical Papers 55, no. 1 (2024): 2029-2032. https://doi.org/10.1002/sdtp.17997.
MLA (9th ed.) CitationJeong, SeongYun, et al. "P‐169: Study on the Behavior of Adhesive Cohesive Properties According to Cyclic Test of Foldable Products." SID International Symposium Digest of Technical Papers, vol. 55, no. 1, 2024, pp. 2029-2032, https://doi.org/10.1002/sdtp.17997.