P‐97: Improved Electrical Performance and Realiability of a‐IGZO TFT by N2O Plasma Treatment Optimization

This study investigates the abnormal reliability degradations observed under positive bias temperature stress (PBTS) in a‐IGZO TFTs treated by N2O plasma treatment and proposes a solution according to the presence of N2O plasma in the subsequent postprocess. In mass manufacture of a‐IGZO TFTs, N2O p...

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Published inSID International Symposium Digest of technical papers Vol. 55; no. 1; pp. 1762 - 1765
Main Authors Kim, Hyojung, Sung, Hyesun, Shim, Seungbo, Lee, Dooyoul
Format Journal Article
LanguageEnglish
Published Campbell Wiley Subscription Services, Inc 01.06.2024
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ISSN0097-966X
2168-0159
DOI10.1002/sdtp.17914

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Abstract This study investigates the abnormal reliability degradations observed under positive bias temperature stress (PBTS) in a‐IGZO TFTs treated by N2O plasma treatment and proposes a solution according to the presence of N2O plasma in the subsequent postprocess. In mass manufacture of a‐IGZO TFTs, N2O plasma is usually completely removed during the subsequent post‐plasma treatment processes. However, we maintained the presence of N2O plasma and analyzed its effect on device performance and reliability. While a‐IGZO TFTs fabricated with N2O plasmaremoved during the post‐process exhibited non‐ideal negative Vth shifts under PBTS, the devices fabricated with N2O plasma present during post‐processing showed superior electrical performance and reliability, avoiding the non‐ideal Vth shift phenomenon. This study shows that maintaining N2O plasma during the post‐process is an effective method for ensuring device reliability as well as improved performance of a‐IGZO TFTs in mass production.
AbstractList This study investigates the abnormal reliability degradations observed under positive bias temperature stress (PBTS) in a‐IGZO TFTs treated by N 2 O plasma treatment and proposes a solution according to the presence of N 2 O plasma in the subsequent postprocess. In mass manufacture of a‐IGZO TFTs, N 2 O plasma is usually completely removed during the subsequent post‐plasma treatment processes. However, we maintained the presence of N 2 O plasma and analyzed its effect on device performance and reliability. While a‐IGZO TFTs fabricated with N 2 O plasmaremoved during the post‐process exhibited non‐ideal negative V th shifts under PBTS, the devices fabricated with N 2 O plasma present during post‐processing showed superior electrical performance and reliability, avoiding the non‐ideal V th shift phenomenon. This study shows that maintaining N 2 O plasma during the post‐process is an effective method for ensuring device reliability as well as improved performance of a‐IGZO TFTs in mass production.
This study investigates the abnormal reliability degradations observed under positive bias temperature stress (PBTS) in a‐IGZO TFTs treated by N2O plasma treatment and proposes a solution according to the presence of N2O plasma in the subsequent postprocess. In mass manufacture of a‐IGZO TFTs, N2O plasma is usually completely removed during the subsequent post‐plasma treatment processes. However, we maintained the presence of N2O plasma and analyzed its effect on device performance and reliability. While a‐IGZO TFTs fabricated with N2O plasmaremoved during the post‐process exhibited non‐ideal negative Vth shifts under PBTS, the devices fabricated with N2O plasma present during post‐processing showed superior electrical performance and reliability, avoiding the non‐ideal Vth shift phenomenon. This study shows that maintaining N2O plasma during the post‐process is an effective method for ensuring device reliability as well as improved performance of a‐IGZO TFTs in mass production.
Author Kim, Hyojung
Shim, Seungbo
Sung, Hyesun
Lee, Dooyoul
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Snippet This study investigates the abnormal reliability degradations observed under positive bias temperature stress (PBTS) in a‐IGZO TFTs treated by N2O plasma...
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SubjectTerms a‐IGZO TFTs
Indium gallium zinc oxide
Mass production
N2O plasma treatment
Nitrous oxide
PBTS
Performance degradation
Reliability
XPS
Title P‐97: Improved Electrical Performance and Realiability of a‐IGZO TFT by N2O Plasma Treatment Optimization
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