SU‐E‐T‐447: Growth of Metal Whiskers Under External Beam Irradiation: Experimental Evidence and Implications in Medical Electronic Devices for Radiation Therapy Treatments

• Published in: Medical physics (Lancaster) Vol. 42; no. 6Part19; p. 3437
• Main Authors: Shvydka, D, Warrell, G, Parsai, E, Karpov, V, Vasko, A
• Format: Journal Article
• Language: English
• Published: United States American Association of Physicists in Medicine 01.06.2015
• Subjects: 60 APPLIED LIFE SCIENCES; ALLOYS; Biomedical equipment; CAPACITORS; CARDIAC PACEMAKERS; COLOR CENTERS; ELECTRIC FIELDS; ELECTRON BEAMS; Electron radiation effects; ELECTRON SCANNING; Electronic circuits; Electronic devices; ELECTRONIC EQUIPMENT; FAILURES; GLASS; INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; IRRADIATION; LEAD; LINEAR ACCELERATORS; Metal whiskers; Radiation therapy equipment; Radiation treatment; RADIOTHERAPY; SOLDERING; SUBSTRATES; TIN; WHISKERS
• DOI: 10.1118/1.4924809
• ISSN: 0094-2405

Purpose: Thin metallic protrusions, termed “whiskers,” have been identified as a cause of failure in devices ranging from satellites to pacemakers. For decades, lead was used in tin‐based soldering alloys to suppress whisker formation. With the adoption of the Restriction of Hazardous Substances act and the expiration of its exemption on medical devices, including implanted medical devices (IMDs), electronic circuits are required to be lead‐free as of July 2014. The effect of radiation on such soldering components remains unknown. Methods: We have irradiated a thin (150 nm) tin metal layer, deposited on a 3 mm thick glass substrate, with a 6 MeV medical linac (Varian TrueBeam) electron beam in five 2‐hour long sessions. After receiving ∼10 kGy, whisker growth on the sample was assessed with scanning electron microscopy and compared to a reference sample not exposed to radiation. Results: After 10 hours of irradiation, the sample was found to develop intense whisker infestation, while the reference sample remained in its pristine as‐deposited condition. Repeating the same irradiation schedule generated more and longer whiskers. The observed phenomenon can be explained through charge accumulation in the glass substrate, generating an electric field that promotes whisker growth. The observed substrate glass darkening under irradiation points towards development of color centers related to charge trapping. Experiments on the same type of samples with direct application of the external field in a capacitor‐like setting also resulted in intense whisker growth. Conclusion: Extreme care should be taken in dealing with all electronic devices, especially IMDs, produced with lead‐free solder and components, subject to radiation exposure. While in our experiments strong electric fields were intentionally generated to accelerate whisker growth over hours, in everyday use the circuit soldering may cause problems in a matter of days or months. Designated reliability testing under radiation must be conducted. This work is partially supported by NRC grant No. NRC‐HQ‐12‐G‐38‐0042