Ultrasonic Delamination Based Adhesion Testing for High-Throughput Assembly of van der Waals Heterostructures

• Published in: arXiv.org
• Main Authors: Peña, Tara, Holt, Jewel, Sewaket, Arfan, Wu, Stephen M
• Format: Paper Journal Article
• Language: English
• Published: Ithaca Cornell University Library, arXiv.org 09.12.2022
• Subjects: Adhesion tests; Bilayers; Delamination; Electrical properties; Graphene; Heterostructures; High temperature; Microscopy; Optical properties; Physics - Applied Physics; Physics - Materials Science; Polymers; Process parameters; Silicon substrates; Two dimensional materials; Ultrasonic testing

Two-dimensional (2D) materials assembled into van der Waals (vdW) heterostructures contain unlimited combinations of mechanical, optical, and electrical properties that can be harnessed for potential device applications. Critically, these structures require control over interfacial adhesion in order...