Ultrasonic Delamination Based Adhesion Testing for High-Throughput Assembly of van der Waals Heterostructures - Peña, Tara; Holt, Jewel; Sewaket, Arfan; Wu, Stephen M (arXiv.org, 2022)
Keywords: Adhesion tests; Bilayers; Delamination; Electrical properties; Graphene; Heterostructures; High temperature; Microscopy; Optical properties; Physics - Applied Physics; Physics - Materials Science; Polymers; Process parameters; Silicon substrates; Two dimensional materials; Ultrasonic testing