Encapsulation nanotechnologies

This unique and comprehensive book covers all the recent physical, chemical, and mechanical advancements in encapsulation nanotechnologies. Encapsulation is prevalent in the evolutionary processes of nature, where nature protects the materials from the environment by engulfing them in a suitable she...

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Main Author Mittal, Vikas
Format eBook Book
LanguageEnglish
Published Salem, Mass Wiley 2013
Hoboken, N.J Scrivener Publishing
John Wiley & Sons, Incorporated
Wiley-Blackwell
John Wiley & Sons
Scrivener Pub
Edition1
Subjects
Online AccessGet full text
ISBN9781118344552
1118344553
DOI10.1002/9781118729175

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Abstract This unique and comprehensive book covers all the recent physical, chemical, and mechanical advancements in encapsulation nanotechnologies. Encapsulation is prevalent in the evolutionary processes of nature, where nature protects the materials from the environment by engulfing them in a suitable shell. These natural processes are well known and have been adopted and applied in the pharmaceutical, food, agricultural, and cosmetics industries. In recent years, because of the increased understanding of the material properties and behaviors at nanoscale, research in the encapsulation field has also moved to the generation of nanocapsules, nanocontainers, and other nano devices. One such example is the generation of self-healing nanocontainers holding corrosion inhibitors that can be used in anti-corrosion coatings. The processes used to generate such capsules have also undergone significant developments. Various technologies based on chemical, physical, and physico-chemical synthesis methods have been developed and applied successfully to generate encapsulated materials. Because of the increasing potential and value of the new nanotechnologies and products being used in a large number of commercial processes, the need for compiling one comprehensive volume comprising the recent technological advancements is also correspondingly timely and significant. This volume not only introduces the subject of encapsulation and nanotechnologies to scientists new to the field, but also serves as a reference for experts already working in this area. Encapsulation Nanotechnologies details in part: The copper encapsulation of carbon nanotubes Various aspects of the application of fluid-bed technology for the coating and encapsulation processes The use of the electrospinning technique for encapsulation The concept of microencapsulation by interfacial polymerization Overviews of encapsulation technologies for organic thin-film transistors (OTFTs), polymer capsule technology, the use of supercritical fluids (such as carbon dioxide), iCVD process for large-scale applications in hybrid gas barriers ReadershipEncapsulation Nanotechnologiesis of prime interest to a wide range of materials scientists and engineers, both in industry and academia.
AbstractList This unique and comprehensive book covers all the recent physical, chemical, and mechanical advancements in encapsulation nanotechnologies. Encapsulation is prevalent in the evolutionary processes of nature, where nature protects the materials from the environment by engulfing them in a suitable shell. These natural processes are well known and have been adopted and applied in the pharmaceutical, food, agricultural, and cosmetics industries. In recent years, because of the increased understanding of the material properties and behaviors at nanoscale, research in the encapsulation field has also moved to the generation of nanocapsules, nanocontainers, and other nano devices. One such example is the generation of self-healing nanocontainers holding corrosion inhibitors that can be used in anti-corrosion coatings. The processes used to generate such capsules have also undergone significant developments. Various technologies based on chemical, physical, and physico-chemical synthesis methods have been developed and applied successfully to generate encapsulated materials. Because of the increasing potential and value of the new nanotechnologies and products being used in a large number of commercial processes, the need for compiling one comprehensive volume comprising the recent technological advancements is also correspondingly timely and significant. This volume not only introduces the subject of encapsulation and nanotechnologies to scientists new to the field, but also serves as a reference for experts already working in this area. Encapsulation Nanotechnologies details in part: The copper encapsulation of carbon nanotubes Various aspects of the application of fluid-bed technology for the coating and encapsulation processes The use of the electrospinning technique for encapsulation The concept of microencapsulation by interfacial polymerization Overviews of encapsulation technologies for organic thin-film transistors (OTFTs), polymer capsule technology, the use of supercritical fluids (such as carbon dioxide), iCVD process for large-scale applications in hybrid gas barriers ReadershipEncapsulation Nanotechnologiesis of prime interest to a wide range of materials scientists and engineers, both in industry and academia.
This unique and comprehensive book covers all the recent physical, chemical, and mechanical advancements in encapsulation nanotechnologies. Encapsulation is prevalent in the evolutionary processes of nature, where nature protects the materials from the environment by engulfing them in a suitable shell. These natural processes are well known and have been adopted and applied in the pharmaceutical, food, agricultural, and cosmetics industries. In recent years, because of the increased understanding of the material properties and behaviors at nanoscale, research in the encapsulation field has also moved to the generation of nanocapsules, nanocontainers, and other nano devices. One such example is the generation of self-healing nanocontainers holding corrosion inhibitors that can be used in anti-corrosion coatings. The processes used to generate such capsules have also undergone significant developments. Various technologies based on chemical, physical, and physico-chemical synthesis methods have been developed and applied successfully to generate encapsulated materials. Because of the increasing potential and value of the new nanotechnologies and products being used in a large number of commercial processes, the need for compiling one comprehensive volume comprising the recent technological advancements is also correspondingly timely and significant. This volume not only introduces the subject of encapsulation and nanotechnologies to scientists new to the field, but also serves as a reference for experts already working in this area. Encapsulation Nanotechnologies details in part: The copper encapsulation of carbon nanotubes Various aspects of the application of fluid-bed technology for the coating and encapsulation processes The use of the electrospinning technique for encapsulation The concept of microencapsulation by interfacial polymerization Overviews of encapsulation technologies for organic thin-film transistors (OTFTs), polymer capsule technology, the use of supercritical fluids (such as carbon dioxide), iCVD process for large-scale applications in hybrid gas barriers Readership Encapsulation Nanotechnologiesis of prime interest to a wide range of materials scientists and engineers, both in industry and academia.
Author Mittal, Vikas
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Notes Includes bibliographical references and index
"Also available as an e-book"--Back cover
Available also in a print ed.
Mode of access: Internet via World Wide Web.
Title from title screen.
OCLC 846492781
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John Wiley & Sons, Incorporated
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John Wiley & Sons
Scrivener Pub
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Snippet This unique and comprehensive book covers all the recent physical, chemical, and mechanical advancements in encapsulation nanotechnologies. Encapsulation is...
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SubjectTerms Microencapsulation
Nanotechnology
SubjectTermsDisplay Electronic books.
Microencapsulation.
Nanotechnology.
TableOfContents Cover -- Half Title page -- Title page -- Copyright page -- Preface -- List of Contributors -- Chapter 1: Copper Encapsulation of Multi-Walled Carbon Nanotubes -- 1.1 Introduction -- 1.2 Preparation of Copper Encapsulated CNTs -- References -- Chapter 2: Novel Nanocomposites: Intercalation of Ionically Conductive Polymers into Molybdic Acid -- 2.1 Introduction -- 2.2 Experimental -- 2.3 Intercalation into Molybdic Acid -- 2.4 Preparation of Polymer-Lithium Complexes -- 2.5 Instrumentation -- 2.6 Results and Discussion -- 2.7 Conclusions -- Acknowledgements -- References -- Chapter 3: Fluid-Bed Technology for Encapsulation and Coating Purposes -- 3.1 Introduction -- 3.2 Principles of Fluidization -- 3.3 Classification of Powders -- 3.4 Fluidized Bed Coaters -- 3.5 Fluid-Bed Coating and Encapsulation Processes -- 3.6 The Design, Optimization and Scale-Up of the Coating Process and the Apparatus -- 3.7 Numerical Modeling of Fluid-Bed Coating -- References -- Chapter 4: Use of Electrospinning for Encapsulation -- 4.1 Introduction -- 4.2 Electrospun Structures for the Encapsulation of Bioactive Substances in the Food Area -- 4.3 Electrospun Encapsulation Structures for Biomedical Applications -- 4.4 Other Uses of Electrospinning for Encapsulation -- 4.5 Outlook and Conclusions -- References -- Chapter 5: Microencapsulation by Interfacial Polymerization -- 5.1 Introduction -- 5.2 Generalities -- 5.3 Encapsulation by Heterophase Polymerization -- 5.4 Microencapsulation by Polyaddition &amp -- Polycondensation Interfacial -- 5.5 Microencapsulation by In Situ Polymerization -- 5.6 Conclusion -- References -- Chapter 6: Encapsulation of Silica Particles by a Thin Shell of Poly(Methyl) Methacrylate -- 6.1 Introduction -- 6.2 Synthesis of Silica (Nano)Particles and Their Surface Modification -- 6.3 Encapsulation of Silica Particles in a Thin PMMA Shell
11.3 Encapsulation Procedures and Proton Conduction Performance -- 11.4 New Activities and Development Trends -- References -- Chapter 12: Encapsulation Methods with Supercritical Carbon Dioxide: Basis and Applications -- 12.1 Introduction -- 12.2 Supercritical Fluids - Properties -- 12.3 Particle Engineering and Encapsulation with Supercritical Fluids -- References -- Index
6.4 Summary -- References -- Chapter 7: Organic Thin-Film Transistors with Solution-Processed Encapsulation -- 7.1 Introduction -- 7.2 Environment-Induced Degradations of OTFTs -- 7.3 Encapsulation of OTFTs -- 7.4 Summary and Outlook -- References -- Chapter 8: Tunable Encapsulation Property of Amphiphilic Polymer Based on Hyperbranched Polyethylenimine -- 8.1 Introduction -- 8.2 Synthesis of PEI-CAMs -- 8.3 Unimolecularity versus Aggregate of PEI-CAMs -- 8.4 Host-Guest Chemistry of PEI-CAMs -- 8.5 Charge Selective Encapsulation and Separation -- 8.6 Recognition and Separation of Anionic-Anionic Mixtures by Core Engineering of a CAM -- 8.7 Modulation of the Guest Release of a CAM -- 8.8 Concluding Remarks -- Acknowledgements -- References -- Chapter 9: Polymer Layers by Initiated CVD for Thin Film Gas Barrier Encapsulation -- 9.1 Introduction -- 9.2 Initiated CVD Polymerization -- 9.3 Coating by Initiated CVD -- 9.4 Advantages of iCVD in Hybrid Multilayer Gas Barriers -- 9.5 Specific Requirements for the Use in Hybrid Multilayers -- 9.6 Multilayer Gas Barriers Containing Polymers by iCVD -- 9.7 Upscaling and Utilization -- References -- Chapter 10: Polymeric Hollow Particles for Encapsulation of Chemical Molecules -- 10.1 Introduction -- 10.2 Colloidosome Approach -- 10.3 Internal Phase Separation/Precipitation Approach -- 10.4 Self-Assembly of Amphiphilic Copolymers (Copolymer Vesicles) -- 10.5 Layer-by-Layer (L-b-L) Deposition -- 10.6 Unimolecular Micelles Approach -- 10.7 Heterophase Polymerization -- 10.8 Key Design Features for Applications of Hollow Polymer Particles -- 10.9 Conclusions -- References -- Chapter 11: Protic Ionic Liquids Confinement in Macro, Meso and Microporous Materials for Proton Conduction -- 11.1 Introduction -- 11.2 Structure and Properties of Materials for Proton Conduction
Title Encapsulation nanotechnologies
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