Electromagnetic compatibility engineering

Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." -EE Times Electromagnetic Compatibility Engineeri...

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Bibliographic Details
Main Author Ott, Henry W
Format eBook Book
LanguageEnglish
Published Hoboken, N.J WILEY 2009
John Wiley & Sons
John Wiley & Sons, Incorporated
Wiley-Blackwell
Edition1
Subjects
Circuits
Electromagnetic compatibility
Electronic circuits
Electronic circuits > Noise
Electronics
Noise
Technology
Online AccessGet full text

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Table of Contents:
  • Electromagnetic compatibility engineering -- Contents -- Preface -- Part I: EMC Theory -- 1. Electromagnetic Compatibility -- 2. Cabling -- 3. Grounding -- 4. Balancing and Filtering -- 5. Passive Components -- 6. Shielding -- 7. Contact Protection -- 8. Intrinsic Noise Sources -- 9. Active Device Noise -- 10. Digital Circuit Grounding -- Part II: EMC Applications -- 11. Digital Circuit Power Distribution -- 12. Digital Circuit Radiation -- 13. Conducted Emissions -- 14. RF and Transient Immunity -- 15. Electrostatic Discharge -- 16. PCB Layout and Stackup -- 17. Mixed-Signal PCB Layout -- 18. Precompliance EMC Measurements -- Appendix -- Index
  • 12.4.4 Dealing With Common-Mode Radiation Issues
  • 2.14 Spiral Shields -- 2.15 Shield Terminations -- 2.15.1 Pigtails -- 2.15.2 Grounding of Cable Shields -- 2.16 Ribbon Cables -- 2.17 Electrically Long Cables -- Summary -- Problems -- References -- Further Reading -- 3. Grounding -- 3.1 AC Power Distribution and Safety Grounds -- 3.1.1 Service Entrance -- 3.1.2 Branch Circuits -- 3.1.3 Noise Control -- 3.1.4 Earth Grounds -- 3.1.5 Isolated Grounds -- 3.1.6 Separately Derived Systems -- 3.1.7 Grounding Myths -- 3.2 Signal Grounds -- 3.2.1 Single-Point Ground Systems -- 3.2.2 Multipoint Ground Systems -- 3.2.3 Common Impedance Coupling -- 3.2.4 Hybrid Grounds -- 3.2.5 Chassis Grounds -- 3.3 Equipment/System Grounding -- 3.3.1 Isolated Systems -- 3.3.2 Clustered Systems -- 3.3.3 Distributed Systems -- 3.4 Ground Loops -- 3.5 Low-Frequency Analysis of Common-Mode Choke -- 3.6 High-Frequency Analysis of Common-Mode Choke -- 3.7 Single Ground Reference for a Circuit -- Summary -- Problems -- References -- Further Reading -- 4. Balancing and Filtering -- 4.1 Balancing -- 4.1.1 Common-Mode Rejection Ratio -- 4.1.2 Cable Balance -- 4.1.3 System Balance -- 4.1.4 Balanced Loads -- 4.2 Filtering -- 4.2.1 Common-Mode Filters -- 4.2.2 Parasitic Effects in Filters -- 4.3 Power Supply Decoupling -- 4.3.1 Low-Frequency Analog Circuit Decoupling -- 4.3.2 Amplifier Decoupling -- 4.4 Driving Capacitive Loads -- 4.5 System Bandwidth -- 4.6 Modulation and Coding -- Summary -- Problems -- References -- Further Reading -- 5. Passive Components -- 5.1 Capacitors -- 5.1.1 Electrolytic Capacitors -- 5.1.2 Film Capacitors -- 5.1.3 Mica and Ceramic Capacitors -- 5.1.4 Feed-Through Capacitors -- 5.1.5 Paralleling Capacitors -- 5.2 Inductors -- 5.3 Transformers -- 5.4 Resistors -- 5.4.1 Noise in Resistors -- 5.5 Conductors -- 5.5.1 Inductance of Round Conductors -- 5.5.2 Inductance of Rectangular Conductors
  • 5.5.3 Resistance of Round Conductors -- 5.5.4 Resistance of Rectangular Conductors -- 5.6 Transmission Lines -- 5.6.1 Characteristic Impedance -- 5.6.2 Propagation Constant -- 5.6.3 High-Frequency Loss -- 5.6.4 Relationship Among C, L and ε(r). -- 5.6.5 Final Thoughts -- 5.7 Ferrites -- Summary -- Problems -- References -- Further Reading -- 6. Shielding -- 6.1 Near Fields and Far Fields -- 6.2 Characteristic and Wave Impedances -- 6.3 Shielding Effectiveness -- 6.4 Absorption Loss -- 6.5 Reflection Loss -- 6.5.1 Reflection Loss to Plane Waves -- 6.5.2 Reflection Loss in the Near Field -- 6.5.3 Electric Field Reflection Loss -- 6.5.4 Magnetic Field Reflection Loss -- 6.5.5 General Equations for Reflection Loss -- 6.5.6 Multiple Reflections in Thin Shields -- 6.6 Composite Absorption and Reflection Loss -- 6.6.1 Plane Waves -- 6.6.2 Electric Fields -- 6.6.3 Magnetic Fields -- 6.7 Summary of Shielding Equations -- 6.8 Shielding with Magnetic Materials -- 6.9 Experimental Data -- 6.10 Apertures -- 6.10.1 Multiple Apertures -- 6.10.2 Seams -- 6.10.3 Transfer Impedance -- 6.11 Waveguide Below Cutoff -- 6.12 Conductive Gaskets -- 6.12.1 Joints of Dissimilar Metals -- 6.12.2 Mounting of Conductive Gaskets -- 6.13 The "IDEAL" Shield -- 6.14 Conductive Windows -- 6.14.1 Transparent Conductive Coatings -- 6.14.2 Wire Mesh Screens -- 6.14.3 Mounting of Windows -- 6.15 Conductive Coatings -- 6.15.1 Conductive Paints -- 6.15.2 Flame/Arc Spray -- 6.15.3 Vacuum Metalizing -- 6.15.4 Electroless Plating -- 6.15.5 Metal Foil Linings -- 6.15.6 Filled Plastic -- 6.16 Internal Shields -- 6.17 Cavity Resonance -- 6.18 Grounding of Shields -- Summary -- Problems -- References -- Further Reading -- 7. Contact Protection -- 7.1 Glow Discharges -- 7.2 Metal-Vapor or Arc Discharges -- 7.3 AC Versus DC Circuits -- 7.4 Contact Material -- 7.5 Contact Rating
  • 7.6 Loads with High Inrush Currents -- 7.7 Inductive Loads -- 7.8 Contact Protection Fundamentals -- 7.9 Transient Suppression for Inductive Loads -- 7.10 Contact Protection Networks for Inductive Loads -- 7.10.1 C Network -- 7.10.2 R-C Network -- 7.10.3 R-C-D Network -- 7.11 Inductive Loads Controlled by a Transistor Switch -- 7.12 Resistive Load Contact Protection -- 7.13 Contact Protection Selection Guide -- 7.14 Examples -- Summary -- Problems -- References -- Further Reading -- 8. Intrinsic Noise Sources -- 8.1 Thermal Noise -- 8.2 Characteristics of Thermal Noise -- 8.3 Equivalent Noise Bandwidth -- 8.4 Shot Noise -- 8.5 Contact Noise -- 8.6 Popcorn Noise -- 8.7 Addition of Noise Voltages -- 8.8 Measuring Random Noise -- Summary -- Problems -- References -- Further Reading -- 9. Active Device Noise -- 9.1 Noise Factor -- 9.2 Measurement of Noise Factor -- 9.2.1 Single-Frequency Method -- 9.2.2 Noise Diode Method -- 9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor -- 9.4 Noise Voltage and Current Model -- 9.5 Measurment of V(n) and I(n) -- 9.6 Calculating Noise Factor and S/N Ratio from V(n)-I(n) -- 9.7 Optimum Source Resistance -- 9.8 Noise Factor of Cascaded Stages -- 9.9 Noise Temperature -- 9.10 Bipolar Transistor Noise -- 9.10.1 Transistor Noise Factor -- 9.10.2 V(n)-I(n) for Transistors -- 9.11 Field-Effect Transistor Noise -- 9.11.1 FET Noise Factor -- 9.11.2 V(n)-I(n) Representation of FET Noise -- 9.12 Noise in Operational Amplifiers -- 9.12.1 Methods of Specifying Op-Amp Noise -- 9.12.2 Op-Amp Noise Factor -- Summary -- Problems -- References -- Further Reading -- 10. Digital Circuit Grounding -- 10.1 Frequency Versus Time Domain -- 10.2 Analog Versus Digital Circuits -- 10.3 Digital Logic Noise -- 10.4 Internal Noise Sources -- 10.5 Digital Circuit Ground Noise -- 10.5.1 Minimizing Inductance
  • Intro -- Electromagnetic Compatibility Engineering -- CONTENTS -- Preface -- PART 1 EMC THEORY -- 1. Electromagnetic Compatibility -- 1.1 Introduction -- 1.2 Noise and Interference -- 1.3 Designing for Electromagnetic Compatibility -- 1.4 Engineering Documentation and EMC -- 1.5 United States' EMC Regulations -- 1.5.1 FCC Regulations -- 1.5.2 FCC Part 15, Subpart B -- 1.5.3 Emissions -- 1.5.4 Administrative Procedures -- 1.5.5 Susceptibility -- 1.5.6 Medical Equipment -- 1.5.7 Telecom -- 1.5.8 Automotive -- 1.6 Canadian EMC Requirements -- 1.7 European Union's EMC Requirements -- 1.7.1 Emission Requirements -- 1.7.2 Harmonics and Flicker -- 1.7.3 Immunity Requirements -- 1.7.4 Directives and Standards -- 1.8 International Harmonization -- 1.9 Military Standards -- 1.10 Avionics -- 1.11 The Regulatory Process -- 1.12 Typical Noise Path -- 1.13 Methods of Noise Coupling -- 1.13.1 Conductively Coupled Noise -- 1.13.2 Common Impedance Coupling -- 1.13.3 Electric and Magnetic Field Coupling -- 1.14 Miscellaneous Noise Sources -- 1.14.1 Galvanic Action -- 1.14.2 Electrolytic Action -- 1.14.3 Triboelectric Effect -- 1.14.4 Conductor Motion -- 1.15 Use of Network Theory -- Summary -- Problems -- References -- Further Reading -- 2. Cabling -- 2.1 Capacitive Coupling -- 2.2 Effect of Shield on Capacitive Coupling -- 2.3 Inductive Coupling -- 2.4 Mutual Inductance Calculations -- 2.5 Effect of Shield on Magnetic Coupling -- 2.5.1 Magnetic Coupling Between Shield and Inner Conductor -- 2.5.2 Magnetic Coupling-Open Wire to Shielded Conductor -- 2.6 Shielding to Prevent Magnetic Radiation -- 2.7 Shielding a Receptor Against Magnetic Fields -- 2.8 Common Impedance Shield Coupling -- 2.9 Experimental Data -- 2.10 Example of Selective Shielding -- 2.11 Shield Transfer Impedance -- 2.12 Coaxial Cable Versus Twisted Pair -- 2.13 Braided Shields
  • 10.5.2 Mutual Inductance -- 10.5.3 Practical Digital Circuit Ground Systems -- 10.5.4 Loop Area -- 10.6 Ground Plane Current Distribution and Impedance -- 10.6.1 Reference Plane Current Distribution -- 10.6.2 Ground Plane Impedance -- 10.6.3 Ground Plane Voltage -- 10.6.4 End Effects -- 10.7 Digital Logic Current Flow -- 10.7.1 Microstrip Line -- 10.7.2 Stripline -- 10.7.3 Digital Circuit Current Flow Summary -- Summary -- Problems -- References -- Further Reading -- PART 2 EMC APPLICATIONS -- 11. Digital Circuit Power Distribution -- 11.1 Power Supply Decoupling -- 11.2 Transient Power Supply Currents -- 11.2.1 Transient Load Current -- 11.2.2 Dynamic Internal Current -- 11.2.3 Fourier Spectrum of the Transient Current -- 11.2.4 Total Transient Current -- 11.3 Decoupling Capacitors -- 11.4 Effective Decoupling Strategies -- 11.4.1 Multiple Decoupling Capacitors -- 11.4.2 Multiple Capacitors of the Same Value -- 11.4.3 Multiple Capacitors of Two Different Values -- 11.4.4 Multiple Capacitors of Many Different Values -- 11.4.5 Target Impedance -- 11.4.6 Embedded PCB Capacitance -- 11.4.7 Power Supply Isolation -- 11.5 The Effect of Decoupling on Radiated Emissions -- 11.6 Decoupling Capacitor Type and Value -- 11.7 Decoupling Capacitor Placement and Mounting -- 11.8 Bulk Decoupling Capacitors -- 11.9 Power Entry Filters -- Summary -- Problems -- References -- Further Reading -- 12. Digital Circuit Radiation -- 12.1 Differential-Mode Radiation -- 12.1.1 Loop Area -- 12.1.2 Loop Current -- 12.1.3 Fourier Series -- 12.1.4 Radiated Emission Envelope -- 12.2 Controlling Differential-Mode Radiation -- 12.2.1 Board Layout -- 12.2.2 Canceling Loops -- 12.2.3 Dithered Clocks -- 12.3 Common-Mode Radiation -- 12.4 Controlling Common-Mode Radiation -- 12.4.1 Common-Mode Voltage -- 12.4.2 Cable Filtering and Shielding -- 12.4.3 Separate I/O Grounds