Electromagnetic compatibility engineering
Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." -EE Times Electromagnetic Compatibility Engineeri...
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| Main Author | |
|---|---|
| Format | eBook Book |
| Language | English |
| Published |
Hoboken, N.J
WILEY
2009
John Wiley & Sons John Wiley & Sons, Incorporated Wiley-Blackwell |
| Edition | 1 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." -EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information-such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD-that made the previous book such a wide success, this new book includes additional coverage of: Equipment/systems grounding Switching power supplies and variable-speed motor drives Digital circuit power distribution and decoupling PCB layout and stack-up Mixed-signal PCB layout RF and transient immunity Power line disturbances Precompliance EMC measurements New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels. |
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| AbstractList | Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." -EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction¿and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information-such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD-that made the previous book such a wide success, this new book includes additional coverage of: Equipment/systems grounding Switching power supplies and variable-speed motor drives Digital circuit power distribution and decoupling PCB layout and stack-up Mixed-signal PCB layout RF and transient immunity Power line disturbances Precompliance EMC measurements New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels. |
| Author | Ott, Henry W |
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| Notes | Earlier ed. published under title: Noise reduction techniques in electronic systems, 1988 HTTP:URL=http://www.loc.gov/catdir/enhancements/fy0906/2009006814-d.html Information=Publisher description HTTP:URL=http://www.loc.gov/catdir/enhancements/fy0913/2009006814-b.html Information=Contributor biographical information HTTP:URL=http://www.loc.gov/catdir/enhancements/fy0917/2009006814-t.html Information=Table of contents only Includes bibliographical references and index Available also in a print ed. Mode of access: Internet via World Wide Web. Title from title screen. Revised ed. of: Noise reduction techniques in electronic systems, 1988. |
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| Publisher | WILEY John Wiley & Sons John Wiley & Sons, Incorporated Wiley-Blackwell |
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| Snippet | Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the... |
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| SubjectTerms | Circuits Electromagnetic compatibility Electronic circuits Electronic circuits -- Noise Electronics Noise Technology |
| SubjectTermsDisplay | Circuits Electromagnetic compatibility. Electronic books. Electronic circuits -- Noise. Electronics Technology |
| TableOfContents | Electromagnetic compatibility engineering -- Contents -- Preface -- Part I: EMC Theory -- 1. Electromagnetic Compatibility -- 2. Cabling -- 3. Grounding -- 4. Balancing and Filtering -- 5. Passive Components -- 6. Shielding -- 7. Contact Protection -- 8. Intrinsic Noise Sources -- 9. Active Device Noise -- 10. Digital Circuit Grounding -- Part II: EMC Applications -- 11. Digital Circuit Power Distribution -- 12. Digital Circuit Radiation -- 13. Conducted Emissions -- 14. RF and Transient Immunity -- 15. Electrostatic Discharge -- 16. PCB Layout and Stackup -- 17. Mixed-Signal PCB Layout -- 18. Precompliance EMC Measurements -- Appendix -- Index 12.4.4 Dealing With Common-Mode Radiation Issues 2.14 Spiral Shields -- 2.15 Shield Terminations -- 2.15.1 Pigtails -- 2.15.2 Grounding of Cable Shields -- 2.16 Ribbon Cables -- 2.17 Electrically Long Cables -- Summary -- Problems -- References -- Further Reading -- 3. Grounding -- 3.1 AC Power Distribution and Safety Grounds -- 3.1.1 Service Entrance -- 3.1.2 Branch Circuits -- 3.1.3 Noise Control -- 3.1.4 Earth Grounds -- 3.1.5 Isolated Grounds -- 3.1.6 Separately Derived Systems -- 3.1.7 Grounding Myths -- 3.2 Signal Grounds -- 3.2.1 Single-Point Ground Systems -- 3.2.2 Multipoint Ground Systems -- 3.2.3 Common Impedance Coupling -- 3.2.4 Hybrid Grounds -- 3.2.5 Chassis Grounds -- 3.3 Equipment/System Grounding -- 3.3.1 Isolated Systems -- 3.3.2 Clustered Systems -- 3.3.3 Distributed Systems -- 3.4 Ground Loops -- 3.5 Low-Frequency Analysis of Common-Mode Choke -- 3.6 High-Frequency Analysis of Common-Mode Choke -- 3.7 Single Ground Reference for a Circuit -- Summary -- Problems -- References -- Further Reading -- 4. Balancing and Filtering -- 4.1 Balancing -- 4.1.1 Common-Mode Rejection Ratio -- 4.1.2 Cable Balance -- 4.1.3 System Balance -- 4.1.4 Balanced Loads -- 4.2 Filtering -- 4.2.1 Common-Mode Filters -- 4.2.2 Parasitic Effects in Filters -- 4.3 Power Supply Decoupling -- 4.3.1 Low-Frequency Analog Circuit Decoupling -- 4.3.2 Amplifier Decoupling -- 4.4 Driving Capacitive Loads -- 4.5 System Bandwidth -- 4.6 Modulation and Coding -- Summary -- Problems -- References -- Further Reading -- 5. Passive Components -- 5.1 Capacitors -- 5.1.1 Electrolytic Capacitors -- 5.1.2 Film Capacitors -- 5.1.3 Mica and Ceramic Capacitors -- 5.1.4 Feed-Through Capacitors -- 5.1.5 Paralleling Capacitors -- 5.2 Inductors -- 5.3 Transformers -- 5.4 Resistors -- 5.4.1 Noise in Resistors -- 5.5 Conductors -- 5.5.1 Inductance of Round Conductors -- 5.5.2 Inductance of Rectangular Conductors 5.5.3 Resistance of Round Conductors -- 5.5.4 Resistance of Rectangular Conductors -- 5.6 Transmission Lines -- 5.6.1 Characteristic Impedance -- 5.6.2 Propagation Constant -- 5.6.3 High-Frequency Loss -- 5.6.4 Relationship Among C, L and ε(r). -- 5.6.5 Final Thoughts -- 5.7 Ferrites -- Summary -- Problems -- References -- Further Reading -- 6. Shielding -- 6.1 Near Fields and Far Fields -- 6.2 Characteristic and Wave Impedances -- 6.3 Shielding Effectiveness -- 6.4 Absorption Loss -- 6.5 Reflection Loss -- 6.5.1 Reflection Loss to Plane Waves -- 6.5.2 Reflection Loss in the Near Field -- 6.5.3 Electric Field Reflection Loss -- 6.5.4 Magnetic Field Reflection Loss -- 6.5.5 General Equations for Reflection Loss -- 6.5.6 Multiple Reflections in Thin Shields -- 6.6 Composite Absorption and Reflection Loss -- 6.6.1 Plane Waves -- 6.6.2 Electric Fields -- 6.6.3 Magnetic Fields -- 6.7 Summary of Shielding Equations -- 6.8 Shielding with Magnetic Materials -- 6.9 Experimental Data -- 6.10 Apertures -- 6.10.1 Multiple Apertures -- 6.10.2 Seams -- 6.10.3 Transfer Impedance -- 6.11 Waveguide Below Cutoff -- 6.12 Conductive Gaskets -- 6.12.1 Joints of Dissimilar Metals -- 6.12.2 Mounting of Conductive Gaskets -- 6.13 The "IDEAL" Shield -- 6.14 Conductive Windows -- 6.14.1 Transparent Conductive Coatings -- 6.14.2 Wire Mesh Screens -- 6.14.3 Mounting of Windows -- 6.15 Conductive Coatings -- 6.15.1 Conductive Paints -- 6.15.2 Flame/Arc Spray -- 6.15.3 Vacuum Metalizing -- 6.15.4 Electroless Plating -- 6.15.5 Metal Foil Linings -- 6.15.6 Filled Plastic -- 6.16 Internal Shields -- 6.17 Cavity Resonance -- 6.18 Grounding of Shields -- Summary -- Problems -- References -- Further Reading -- 7. Contact Protection -- 7.1 Glow Discharges -- 7.2 Metal-Vapor or Arc Discharges -- 7.3 AC Versus DC Circuits -- 7.4 Contact Material -- 7.5 Contact Rating 7.6 Loads with High Inrush Currents -- 7.7 Inductive Loads -- 7.8 Contact Protection Fundamentals -- 7.9 Transient Suppression for Inductive Loads -- 7.10 Contact Protection Networks for Inductive Loads -- 7.10.1 C Network -- 7.10.2 R-C Network -- 7.10.3 R-C-D Network -- 7.11 Inductive Loads Controlled by a Transistor Switch -- 7.12 Resistive Load Contact Protection -- 7.13 Contact Protection Selection Guide -- 7.14 Examples -- Summary -- Problems -- References -- Further Reading -- 8. Intrinsic Noise Sources -- 8.1 Thermal Noise -- 8.2 Characteristics of Thermal Noise -- 8.3 Equivalent Noise Bandwidth -- 8.4 Shot Noise -- 8.5 Contact Noise -- 8.6 Popcorn Noise -- 8.7 Addition of Noise Voltages -- 8.8 Measuring Random Noise -- Summary -- Problems -- References -- Further Reading -- 9. Active Device Noise -- 9.1 Noise Factor -- 9.2 Measurement of Noise Factor -- 9.2.1 Single-Frequency Method -- 9.2.2 Noise Diode Method -- 9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor -- 9.4 Noise Voltage and Current Model -- 9.5 Measurment of V(n) and I(n) -- 9.6 Calculating Noise Factor and S/N Ratio from V(n)-I(n) -- 9.7 Optimum Source Resistance -- 9.8 Noise Factor of Cascaded Stages -- 9.9 Noise Temperature -- 9.10 Bipolar Transistor Noise -- 9.10.1 Transistor Noise Factor -- 9.10.2 V(n)-I(n) for Transistors -- 9.11 Field-Effect Transistor Noise -- 9.11.1 FET Noise Factor -- 9.11.2 V(n)-I(n) Representation of FET Noise -- 9.12 Noise in Operational Amplifiers -- 9.12.1 Methods of Specifying Op-Amp Noise -- 9.12.2 Op-Amp Noise Factor -- Summary -- Problems -- References -- Further Reading -- 10. Digital Circuit Grounding -- 10.1 Frequency Versus Time Domain -- 10.2 Analog Versus Digital Circuits -- 10.3 Digital Logic Noise -- 10.4 Internal Noise Sources -- 10.5 Digital Circuit Ground Noise -- 10.5.1 Minimizing Inductance Intro -- Electromagnetic Compatibility Engineering -- CONTENTS -- Preface -- PART 1 EMC THEORY -- 1. Electromagnetic Compatibility -- 1.1 Introduction -- 1.2 Noise and Interference -- 1.3 Designing for Electromagnetic Compatibility -- 1.4 Engineering Documentation and EMC -- 1.5 United States' EMC Regulations -- 1.5.1 FCC Regulations -- 1.5.2 FCC Part 15, Subpart B -- 1.5.3 Emissions -- 1.5.4 Administrative Procedures -- 1.5.5 Susceptibility -- 1.5.6 Medical Equipment -- 1.5.7 Telecom -- 1.5.8 Automotive -- 1.6 Canadian EMC Requirements -- 1.7 European Union's EMC Requirements -- 1.7.1 Emission Requirements -- 1.7.2 Harmonics and Flicker -- 1.7.3 Immunity Requirements -- 1.7.4 Directives and Standards -- 1.8 International Harmonization -- 1.9 Military Standards -- 1.10 Avionics -- 1.11 The Regulatory Process -- 1.12 Typical Noise Path -- 1.13 Methods of Noise Coupling -- 1.13.1 Conductively Coupled Noise -- 1.13.2 Common Impedance Coupling -- 1.13.3 Electric and Magnetic Field Coupling -- 1.14 Miscellaneous Noise Sources -- 1.14.1 Galvanic Action -- 1.14.2 Electrolytic Action -- 1.14.3 Triboelectric Effect -- 1.14.4 Conductor Motion -- 1.15 Use of Network Theory -- Summary -- Problems -- References -- Further Reading -- 2. Cabling -- 2.1 Capacitive Coupling -- 2.2 Effect of Shield on Capacitive Coupling -- 2.3 Inductive Coupling -- 2.4 Mutual Inductance Calculations -- 2.5 Effect of Shield on Magnetic Coupling -- 2.5.1 Magnetic Coupling Between Shield and Inner Conductor -- 2.5.2 Magnetic Coupling-Open Wire to Shielded Conductor -- 2.6 Shielding to Prevent Magnetic Radiation -- 2.7 Shielding a Receptor Against Magnetic Fields -- 2.8 Common Impedance Shield Coupling -- 2.9 Experimental Data -- 2.10 Example of Selective Shielding -- 2.11 Shield Transfer Impedance -- 2.12 Coaxial Cable Versus Twisted Pair -- 2.13 Braided Shields 10.5.2 Mutual Inductance -- 10.5.3 Practical Digital Circuit Ground Systems -- 10.5.4 Loop Area -- 10.6 Ground Plane Current Distribution and Impedance -- 10.6.1 Reference Plane Current Distribution -- 10.6.2 Ground Plane Impedance -- 10.6.3 Ground Plane Voltage -- 10.6.4 End Effects -- 10.7 Digital Logic Current Flow -- 10.7.1 Microstrip Line -- 10.7.2 Stripline -- 10.7.3 Digital Circuit Current Flow Summary -- Summary -- Problems -- References -- Further Reading -- PART 2 EMC APPLICATIONS -- 11. Digital Circuit Power Distribution -- 11.1 Power Supply Decoupling -- 11.2 Transient Power Supply Currents -- 11.2.1 Transient Load Current -- 11.2.2 Dynamic Internal Current -- 11.2.3 Fourier Spectrum of the Transient Current -- 11.2.4 Total Transient Current -- 11.3 Decoupling Capacitors -- 11.4 Effective Decoupling Strategies -- 11.4.1 Multiple Decoupling Capacitors -- 11.4.2 Multiple Capacitors of the Same Value -- 11.4.3 Multiple Capacitors of Two Different Values -- 11.4.4 Multiple Capacitors of Many Different Values -- 11.4.5 Target Impedance -- 11.4.6 Embedded PCB Capacitance -- 11.4.7 Power Supply Isolation -- 11.5 The Effect of Decoupling on Radiated Emissions -- 11.6 Decoupling Capacitor Type and Value -- 11.7 Decoupling Capacitor Placement and Mounting -- 11.8 Bulk Decoupling Capacitors -- 11.9 Power Entry Filters -- Summary -- Problems -- References -- Further Reading -- 12. Digital Circuit Radiation -- 12.1 Differential-Mode Radiation -- 12.1.1 Loop Area -- 12.1.2 Loop Current -- 12.1.3 Fourier Series -- 12.1.4 Radiated Emission Envelope -- 12.2 Controlling Differential-Mode Radiation -- 12.2.1 Board Layout -- 12.2.2 Canceling Loops -- 12.2.3 Dithered Clocks -- 12.3 Common-Mode Radiation -- 12.4 Controlling Common-Mode Radiation -- 12.4.1 Common-Mode Voltage -- 12.4.2 Cable Filtering and Shielding -- 12.4.3 Separate I/O Grounds |
| Title | Electromagnetic compatibility engineering |
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