Method to Reduce the Contact Resistivity between Galinstan and a Copper Electrode for Electrical Connection in Flexible Devices

• Published in: ACS applied materials & interfaces Vol. 13; no. 15; pp. 18247 - 18254
• Main Authors: Sato, Takashi, Yamagishi, Kento, Hashimoto, Michinao, Iwase, Eiji
• Format: Journal Article
• Language: English
• Published: United States American Chemical Society 21.04.2021
• Subjects: alloys; copper; deformation; electrodes; electronics; liquids; Surfaces, Interfaces, and Applications; galinstan; electronic component; liquid metals; contact resistance; mounting methods

This study demonstrates a method to mount electronic components using gallium-based liquid metals (LMs) with reduced contact resistivity between the LM and a copper (Cu) electrode. Gallium-based LMs have low volume resistivity and low melting points, and they are used as electronic components such a...