Thermal Interface Properties of Cu-filled Vertically Aligned Carbon Nanofiber Arrays - Ngo, Quoc; Cruden, Brett A; Cassell, Alan M; Sims, Gerard; Meyyappan, M; Li, Jun; Yang, Cary Y (Nano letters, 2004)
Keywords: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Contact resistance, contact potential; Cross-disciplinary physics: materials science; rheology; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Electronic transport in interface structures; Exact sciences and technology; Materials science; Nanoscale materials and structures: fabrication and characterization; Nanotubes; Physics; Scanning electron microscopy; Inorganic compounds; Contact resistance; Nanofiber; Crystal growth from vapors; Experimental study; Integrated circuits; CVD; Interfaces; Carbon fibers; Transmission electron microscopy; Nanocomposites; Transition elements; Copper; Nanostructured materials; Thermal conduction