Fabrication and Characterization of a High-Strength Polyimide/Thermoplastic Polyurethane Composite Aerogel with Hydrophobicity and Low Thermal Conductivity

Polyimide (PI) aerogel has surfaced in research and development as a result of its heat resistance, flame retardancy, and low dielectric constant. However, it is still a challenge to reduce the thermal conductivity while improving its mechanical strength and retaining hydrophobicity. Herein, the PI/...

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Published inLangmuir Vol. 39; no. 28; pp. 9693 - 9702
Main Authors Nie, Yihao, Yi, Xibin, Zhao, Xinfu, Yu, Shimo, Zhang, Minna, Zhang, Jian, Dou, Guoliang, Wang, Mengdi
Format Journal Article
LanguageEnglish
Published United States American Chemical Society 18.07.2023
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Abstract Polyimide (PI) aerogel has surfaced in research and development as a result of its heat resistance, flame retardancy, and low dielectric constant. However, it is still a challenge to reduce the thermal conductivity while improving its mechanical strength and retaining hydrophobicity. Herein, the PI/thermoplastic polyurethane (TPU) composite aerogel was synthesized by coupling TPU with PI via a novel method of chemical imidization combined with freeze-drying technology. With this technique, PI aerogel with excellent comprehensive performance is produced. Interestingly, the volume shrinkage of the composite aerogel decreased from 24.14 to 5.47%, which leads to low density (0.095 g/cm3) and elevated porosity (92.4%). In addition, strong mechanical strength (1.29 MPa) and high hydrophobicity (123.6°) were achieved. More importantly, PI/TPU composite aerogel demonstrated a low thermal conductivity of 29.51 mW m–1 K–1 at ambient temperature. Therefore, PI/TPU composite aerogel can be a promising material for hydrophobic and thermal insulation applications.
AbstractList Polyimide (PI) aerogel has surfaced in research and development as a result of its heat resistance, flame retardancy, and low dielectric constant. However, it is still a challenge to reduce the thermal conductivity while improving its mechanical strength and retaining hydrophobicity. Herein, the PI/thermoplastic polyurethane (TPU) composite aerogel was synthesized by coupling TPU with PI via a novel method of chemical imidization combined with freeze-drying technology. With this technique, PI aerogel with excellent comprehensive performance is produced. Interestingly, the volume shrinkage of the composite aerogel decreased from 24.14 to 5.47%, which leads to low density (0.095 g/cm ) and elevated porosity (92.4%). In addition, strong mechanical strength (1.29 MPa) and high hydrophobicity (123.6°) were achieved. More importantly, PI/TPU composite aerogel demonstrated a low thermal conductivity of 29.51 mW m K at ambient temperature. Therefore, PI/TPU composite aerogel can be a promising material for hydrophobic and thermal insulation applications.
Polyimide (PI) aerogel has surfaced in research and development as a result of its heat resistance, flame retardancy, and low dielectric constant. However, it is still a challenge to reduce the thermal conductivity while improving its mechanical strength and retaining hydrophobicity. Herein, the PI/thermoplastic polyurethane (TPU) composite aerogel was synthesized by coupling TPU with PI via a novel method of chemical imidization combined with freeze-drying technology. With this technique, PI aerogel with excellent comprehensive performance is produced. Interestingly, the volume shrinkage of the composite aerogel decreased from 24.14 to 5.47%, which leads to low density (0.095 g/cm3) and elevated porosity (92.4%). In addition, strong mechanical strength (1.29 MPa) and high hydrophobicity (123.6°) were achieved. More importantly, PI/TPU composite aerogel demonstrated a low thermal conductivity of 29.51 mW m–1 K–1 at ambient temperature. Therefore, PI/TPU composite aerogel can be a promising material for hydrophobic and thermal insulation applications.
Author Nie, Yihao
Yu, Shimo
Zhang, Jian
Zhao, Xinfu
Zhang, Minna
Dou, Guoliang
Wang, Mengdi
Yi, Xibin
AuthorAffiliation Shandong Copolymer Silicone Technology Research Institute
Advanced Materials Institute
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Snippet Polyimide (PI) aerogel has surfaced in research and development as a result of its heat resistance, flame retardancy, and low dielectric constant. However, it...
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Title Fabrication and Characterization of a High-Strength Polyimide/Thermoplastic Polyurethane Composite Aerogel with Hydrophobicity and Low Thermal Conductivity
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