Impact of die-to-die and within-die parameter variations on the throughput distribution of multi-core processors
A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of maximum clock frequency (FMAX) and throughput for multi-core processors in a future 22nm technology. The simulator integrates a compact analyti...
Saved in:
Published in | Proceedings of the 2007 international symposium on Low power electronics and design (ISLPED '07) pp. 50 - 55 |
---|---|
Main Authors | , , , |
Format | Conference Proceeding |
Language | English |
Published |
IEEE
01.08.2007
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of maximum clock frequency (FMAX) and throughput for multi-core processors in a future 22nm technology. The simulator integrates a compact analytical throughput model, which captures the key dependencies of multi-core processors, into a statistical simulation framework that models the effects of D2D and WID parameter variations on critical path delays across a die. The salient contributions from this paper are: (1) Product-level variation analysis for multi-core processors must focus on throughput, rather than just FMAX, and (2) Multi-core processors are inherently more variation tolerant than single-core processors due to the larger impact of memory latency and bandwidth on overall throughput. To elucidate these two points, multi-core and single-core processors have a similar chip-level FMAX distribution (mean degradation of 9% and standard deviation of 5%) for multi-threaded applications. In contrast to single-core processors, memory latency and bandwidth constraints significantly limit the throughput dependency on FMAX in multi-core processors, thus reducing the throughput mean degradation and standard deviation by 50%. Since single-threaded applications running on a multi-core processor can execute on the fastest core, mean FMAX and throughput gains of 4% are achieved from the nominal design target. |
---|---|
AbstractList | A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of maximum clock frequency (FMAX) and throughput for multi-core processors in a future 22nm technology. The simulator integrates a compact analytical throughput model, which captures the key dependencies of multi-core processors, into a statistical simulation framework that models the effects of D2D and WID parameter variations on critical path delays across a die. The salient contributions from this paper are: (1) Product-level variation analysis for multi-core processors must focus on throughput, rather than just FMAX, and (2) Multi-core processors are inherently more variation tolerant than single-core processors due to the larger impact of memory latency and bandwidth on overall throughput. To elucidate these two points, multi-core and single-core processors have a similar chip-level FMAX distribution (mean degradation of 9% and standard deviation of 5%) for multi-threaded applications. In contrast to single-core processors, memory latency and bandwidth constraints significantly limit the throughput dependency on FMAX in multi-core processors, thus reducing the throughput mean degradation and standard deviation by 50%. Since single-threaded applications running on a multi-core processor can execute on the fastest core, mean FMAX and throughput gains of 4% are achieved from the nominal design target. |
Author | Srinivasan, S T Alameldeen, A R Wilkerson, C B Bowman, K A |
Author_xml | – sequence: 1 givenname: K A surname: Bowman fullname: Bowman, K A email: keith.a.bowman@intel.com organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA – sequence: 2 givenname: A R surname: Alameldeen fullname: Alameldeen, A R organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA – sequence: 3 givenname: S T surname: Srinivasan fullname: Srinivasan, S T organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA – sequence: 4 givenname: C B surname: Wilkerson fullname: Wilkerson, C B organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA |
BookMark | eNotj8FKxDAURSMo6IyzduEmP1BN0qRNljKoMzDgRtfDa_NqI9OmJKni35uqi8fh3gsH3oqcj35EQm44u-NcqnsudFnrHBYacUZWXBllypoZc0k2MX4wxjjPm5ZXZNoPE7SJ-o5ah0XyRQaF0dIvl3o3_sYJAgyYMNBPCA6S82OkfqSpx3zBz-_9NKcsiCm4Zl72RTjMp-SK1odsCL7FGH2I1-Sig1PEzT_X5O3p8XW7Kw4vz_vtw6EAUetUCMO1rHnDEZnW1jBW1U1XtkzbDhQy3jVSNcik1aBq2-QqP227qgLZgsByTW7_vA4Rj1NwA4Tvo1JcikqUPyd6W4Y |
ContentType | Conference Proceeding |
DBID | 6IE 6IL CBEJK RIE RIL |
DOI | 10.1145/1283780.1283792 |
DatabaseName | IEEE Electronic Library (IEL) Conference Proceedings IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume IEEE Xplore All Conference Proceedings IEEE Xplore IEEE Proceedings Order Plans (POP All) 1998-Present |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: RIE name: IEEE Electronic Library Online url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/ sourceTypes: Publisher |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Engineering |
EISBN | 1595937099 9781595937094 |
EndPage | 55 |
ExternalDocumentID | 5514262 |
Genre | orig-research |
GroupedDBID | 6IE 6IL ACM ADPZR ALMA_UNASSIGNED_HOLDINGS APO CBEJK GUFHI LHSKQ RIE RIL |
ID | FETCH-LOGICAL-a278t-2918471b1ee088d90067bf3c08dfa5e01fb45be04d8a57db5e0780df66a4ca2e3 |
IEDL.DBID | RIE |
IngestDate | Wed Jun 26 19:24:03 EDT 2024 |
IsPeerReviewed | false |
IsScholarly | true |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-LOGICAL-a278t-2918471b1ee088d90067bf3c08dfa5e01fb45be04d8a57db5e0780df66a4ca2e3 |
PageCount | 6 |
ParticipantIDs | ieee_primary_5514262 |
PublicationCentury | 2000 |
PublicationDate | 2007-Aug. |
PublicationDateYYYYMMDD | 2007-08-01 |
PublicationDate_xml | – month: 08 year: 2007 text: 2007-Aug. |
PublicationDecade | 2000 |
PublicationTitle | Proceedings of the 2007 international symposium on Low power electronics and design (ISLPED '07) |
PublicationTitleAbbrev | LPE |
PublicationYear | 2007 |
Publisher | IEEE |
Publisher_xml | – name: IEEE |
SSID | ssj0001137984 |
Score | 1.9125555 |
Snippet | A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of... |
SourceID | ieee |
SourceType | Publisher |
StartPage | 50 |
SubjectTerms | Analytical models Bandwidth Circuit simulation Clocks Degradation Delay FMAX distribution Frequency Microprocessors multi-core Multicore processing parameter fluctuations parameter variations Throughput throughput distribution |
Title | Impact of die-to-die and within-die parameter variations on the throughput distribution of multi-core processors |
URI | https://ieeexplore.ieee.org/document/5514262 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwELZKJ1h4tIi3PDDiNg_HiWdEVZBADFTqVvlxkSpEErUJA78enxPaCjEw2fHgRGfp7nL-vu8IuRUgjQ5NzgIRWMZTSJniws1klAkTKRRDRbTFi5jO-NM8mffI3YYLAwAefAYjnPq7fFuaBktlY4zuETrcvVTKlqu1raeEcSoz3qn3hDwZhyjskqF-ghvxqnOnfYqPHpND8vzz3hY08j5qaj0yX78kGf_7YUdkuOXp0ddNBDomPShOyMGOxOCAVI-eBknLnNolsLpkbqCqsBQrsMvCP6L-9wfiYuin-3Vua3i0LKhLDmnXyKdqarfBetMfCzf0YESGOpi0avkG5Wo9JLPJw9v9lHVdFpiK0qxmkQwxQukQwHkcKzF-6Tw2QWZzlUAQ5ponGgJuM5WkVrslZ1WbC6G4URHEp6RflAWcEapj8PRDyZXgAVdSgkyNAevcrnWJyDkZoO0WVSuksejMdvH38iXZbwupiLa7Iv161cC1ywBqfeOP_hsoX7MU |
link.rule.ids | 310,311,783,787,792,793,799,27937,55086 |
linkProvider | IEEE |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwELaqMgALjxbxxgMjbpPUceIZUbXQVgyt1K3y4yJViCRqUwZ-Pb4klAoxMNnx4EQn6-5y_r7vCLkXII32TcI84VnGI4iY4sLNZBALEygUQ0W0xUQMZvx5Hs4b5GHLhQGAEnwGHZyWd_k2MxsslXUxugfocPdcXh2Liq31U1Hxe5GMea3f4_Ow66O0S4wKCm7Ey86dBipl_OgfkfH3myvYyFtnU-iO-fwlyvjfTzsm7R-mHn3dxqAT0oD0lBzuiAy2SD4siZA0S6hdAisy5gaqUkuxBrtMy0dUAH9HZAz9cD_PVRWPZil16SGtW_nkm8JtsN52yMINSzgiQyVMmleMg2y1bpNZ_2n6OGB1nwWmgiguWCB9jFHaB3A-x0qMYDrpGS-2iQrB8xPNQw0et7EKI6vdkrOqTYRQ3KgAemekmWYpnBOqe1ASECVXgntcSQkyMgasc7zWpSIXpIW2W-SVlMaiNtvl38t3ZH8wHY8Wo-Hk5YocVGVVxN5dk2ax2sCNywcKfVsegy-u7LZf |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Proceedings+of+the+2007+international+symposium+on+Low+power+electronics+and+design+%28ISLPED+%2707%29&rft.atitle=Impact+of+die-to-die+and+within-die+parameter+variations+on+the+throughput+distribution+of+multi-core+processors&rft.au=Bowman%2C+K+A&rft.au=Alameldeen%2C+A+R&rft.au=Srinivasan%2C+S+T&rft.au=Wilkerson%2C+C+B&rft.date=2007-08-01&rft.pub=IEEE&rft.spage=50&rft.epage=55&rft_id=info:doi/10.1145%2F1283780.1283792&rft.externalDocID=5514262 |