Impact of die-to-die and within-die parameter variations on the throughput distribution of multi-core processors

A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of maximum clock frequency (FMAX) and throughput for multi-core processors in a future 22nm technology. The simulator integrates a compact analyti...

Full description

Saved in:
Bibliographic Details
Published inProceedings of the 2007 international symposium on Low power electronics and design (ISLPED '07) pp. 50 - 55
Main Authors Bowman, K A, Alameldeen, A R, Srinivasan, S T, Wilkerson, C B
Format Conference Proceeding
LanguageEnglish
Published IEEE 01.08.2007
Subjects
Online AccessGet full text

Cover

Loading…
Abstract A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of maximum clock frequency (FMAX) and throughput for multi-core processors in a future 22nm technology. The simulator integrates a compact analytical throughput model, which captures the key dependencies of multi-core processors, into a statistical simulation framework that models the effects of D2D and WID parameter variations on critical path delays across a die. The salient contributions from this paper are: (1) Product-level variation analysis for multi-core processors must focus on throughput, rather than just FMAX, and (2) Multi-core processors are inherently more variation tolerant than single-core processors due to the larger impact of memory latency and bandwidth on overall throughput. To elucidate these two points, multi-core and single-core processors have a similar chip-level FMAX distribution (mean degradation of 9% and standard deviation of 5%) for multi-threaded applications. In contrast to single-core processors, memory latency and bandwidth constraints significantly limit the throughput dependency on FMAX in multi-core processors, thus reducing the throughput mean degradation and standard deviation by 50%. Since single-threaded applications running on a multi-core processor can execute on the fastest core, mean FMAX and throughput gains of 4% are achieved from the nominal design target.
AbstractList A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of maximum clock frequency (FMAX) and throughput for multi-core processors in a future 22nm technology. The simulator integrates a compact analytical throughput model, which captures the key dependencies of multi-core processors, into a statistical simulation framework that models the effects of D2D and WID parameter variations on critical path delays across a die. The salient contributions from this paper are: (1) Product-level variation analysis for multi-core processors must focus on throughput, rather than just FMAX, and (2) Multi-core processors are inherently more variation tolerant than single-core processors due to the larger impact of memory latency and bandwidth on overall throughput. To elucidate these two points, multi-core and single-core processors have a similar chip-level FMAX distribution (mean degradation of 9% and standard deviation of 5%) for multi-threaded applications. In contrast to single-core processors, memory latency and bandwidth constraints significantly limit the throughput dependency on FMAX in multi-core processors, thus reducing the throughput mean degradation and standard deviation by 50%. Since single-threaded applications running on a multi-core processor can execute on the fastest core, mean FMAX and throughput gains of 4% are achieved from the nominal design target.
Author Srinivasan, S T
Alameldeen, A R
Wilkerson, C B
Bowman, K A
Author_xml – sequence: 1
  givenname: K A
  surname: Bowman
  fullname: Bowman, K A
  email: keith.a.bowman@intel.com
  organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA
– sequence: 2
  givenname: A R
  surname: Alameldeen
  fullname: Alameldeen, A R
  organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA
– sequence: 3
  givenname: S T
  surname: Srinivasan
  fullname: Srinivasan, S T
  organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA
– sequence: 4
  givenname: C B
  surname: Wilkerson
  fullname: Wilkerson, C B
  organization: Microprocessor Technol. Lab., Intel Corp., Hillsboro, OR, USA
BookMark eNotj8FKxDAURSMo6IyzduEmP1BN0qRNljKoMzDgRtfDa_NqI9OmJKni35uqi8fh3gsH3oqcj35EQm44u-NcqnsudFnrHBYacUZWXBllypoZc0k2MX4wxjjPm5ZXZNoPE7SJ-o5ah0XyRQaF0dIvl3o3_sYJAgyYMNBPCA6S82OkfqSpx3zBz-_9NKcsiCm4Zl72RTjMp-SK1odsCL7FGH2I1-Sig1PEzT_X5O3p8XW7Kw4vz_vtw6EAUetUCMO1rHnDEZnW1jBW1U1XtkzbDhQy3jVSNcik1aBq2-QqP227qgLZgsByTW7_vA4Rj1NwA4Tvo1JcikqUPyd6W4Y
ContentType Conference Proceeding
DBID 6IE
6IL
CBEJK
RIE
RIL
DOI 10.1145/1283780.1283792
DatabaseName IEEE Electronic Library (IEL) Conference Proceedings
IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume
IEEE Xplore All Conference Proceedings
IEEE Xplore
IEEE Proceedings Order Plans (POP All) 1998-Present
DatabaseTitleList
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE Electronic Library Online
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EISBN 1595937099
9781595937094
EndPage 55
ExternalDocumentID 5514262
Genre orig-research
GroupedDBID 6IE
6IL
ACM
ADPZR
ALMA_UNASSIGNED_HOLDINGS
APO
CBEJK
GUFHI
LHSKQ
RIE
RIL
ID FETCH-LOGICAL-a278t-2918471b1ee088d90067bf3c08dfa5e01fb45be04d8a57db5e0780df66a4ca2e3
IEDL.DBID RIE
IngestDate Wed Jun 26 19:24:03 EDT 2024
IsPeerReviewed false
IsScholarly true
Language English
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-a278t-2918471b1ee088d90067bf3c08dfa5e01fb45be04d8a57db5e0780df66a4ca2e3
PageCount 6
ParticipantIDs ieee_primary_5514262
PublicationCentury 2000
PublicationDate 2007-Aug.
PublicationDateYYYYMMDD 2007-08-01
PublicationDate_xml – month: 08
  year: 2007
  text: 2007-Aug.
PublicationDecade 2000
PublicationTitle Proceedings of the 2007 international symposium on Low power electronics and design (ISLPED '07)
PublicationTitleAbbrev LPE
PublicationYear 2007
Publisher IEEE
Publisher_xml – name: IEEE
SSID ssj0001137984
Score 1.9125555
Snippet A statistical performance simulator is developed to explore the impact of die-to-die (D2D) and within-die (WID) parameter variations on the distributions of...
SourceID ieee
SourceType Publisher
StartPage 50
SubjectTerms Analytical models
Bandwidth
Circuit simulation
Clocks
Degradation
Delay
FMAX distribution
Frequency
Microprocessors
multi-core
Multicore processing
parameter fluctuations
parameter variations
Throughput
throughput distribution
Title Impact of die-to-die and within-die parameter variations on the throughput distribution of multi-core processors
URI https://ieeexplore.ieee.org/document/5514262
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwELZKJ1h4tIi3PDDiNg_HiWdEVZBADFTqVvlxkSpEErUJA78enxPaCjEw2fHgRGfp7nL-vu8IuRUgjQ5NzgIRWMZTSJniws1klAkTKRRDRbTFi5jO-NM8mffI3YYLAwAefAYjnPq7fFuaBktlY4zuETrcvVTKlqu1raeEcSoz3qn3hDwZhyjskqF-ghvxqnOnfYqPHpND8vzz3hY08j5qaj0yX78kGf_7YUdkuOXp0ddNBDomPShOyMGOxOCAVI-eBknLnNolsLpkbqCqsBQrsMvCP6L-9wfiYuin-3Vua3i0LKhLDmnXyKdqarfBetMfCzf0YESGOpi0avkG5Wo9JLPJw9v9lHVdFpiK0qxmkQwxQukQwHkcKzF-6Tw2QWZzlUAQ5ponGgJuM5WkVrslZ1WbC6G4URHEp6RflAWcEapj8PRDyZXgAVdSgkyNAevcrnWJyDkZoO0WVSuksejMdvH38iXZbwupiLa7Iv161cC1ywBqfeOP_hsoX7MU
link.rule.ids 310,311,783,787,792,793,799,27937,55086
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV07T8MwELaqMgALjxbxxgMjbpPUceIZUbXQVgyt1K3y4yJViCRqUwZ-Pb4klAoxMNnx4EQn6-5y_r7vCLkXII32TcI84VnGI4iY4sLNZBALEygUQ0W0xUQMZvx5Hs4b5GHLhQGAEnwGHZyWd_k2MxsslXUxugfocPdcXh2Liq31U1Hxe5GMea3f4_Ow66O0S4wKCm7Ey86dBipl_OgfkfH3myvYyFtnU-iO-fwlyvjfTzsm7R-mHn3dxqAT0oD0lBzuiAy2SD4siZA0S6hdAisy5gaqUkuxBrtMy0dUAH9HZAz9cD_PVRWPZil16SGtW_nkm8JtsN52yMINSzgiQyVMmleMg2y1bpNZ_2n6OGB1nwWmgiguWCB9jFHaB3A-x0qMYDrpGS-2iQrB8xPNQw0et7EKI6vdkrOqTYRQ3KgAemekmWYpnBOqe1ASECVXgntcSQkyMgasc7zWpSIXpIW2W-SVlMaiNtvl38t3ZH8wHY8Wo-Hk5YocVGVVxN5dk2ax2sCNywcKfVsegy-u7LZf
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Proceedings+of+the+2007+international+symposium+on+Low+power+electronics+and+design+%28ISLPED+%2707%29&rft.atitle=Impact+of+die-to-die+and+within-die+parameter+variations+on+the+throughput+distribution+of+multi-core+processors&rft.au=Bowman%2C+K+A&rft.au=Alameldeen%2C+A+R&rft.au=Srinivasan%2C+S+T&rft.au=Wilkerson%2C+C+B&rft.date=2007-08-01&rft.pub=IEEE&rft.spage=50&rft.epage=55&rft_id=info:doi/10.1145%2F1283780.1283792&rft.externalDocID=5514262