System-in-package (SIP) challenges and opportunities
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Published in | Proceedings of the 2000 Asia and South Pacific Design Automation Conference pp. 191 - 196 |
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Main Author | |
Format | Conference Proceeding |
Language | English |
Published |
New York, NY, USA
ACM
28.01.2000
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Series | ACM Conferences |
Subjects | |
Online Access | Get full text |
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Author | Tai, King L. |
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SubjectTerms | Hardware Hardware -- Electronic design automation Hardware -- Electronic design automation -- Physical design (EDA) Hardware -- Emerging technologies Hardware -- Hardware validation Hardware -- Integrated circuits Hardware -- Very large scale integration design Networks Networks -- Network types Networks -- Network types -- Ad hoc networks Networks -- Network types -- Ad hoc networks -- Mobile ad hoc networks |
Subtitle | challenges and opportunities |
Title | System-in-package (SIP) |
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