APA (7th ed.) Citation

Mondal, M., Ricketts, A. J., Kirolos, S., Ragheb, T., Link, G., Vijaykrishnan, N., & Massoud, Y. (2007, April 16). Thermally robust clocking schemes for 3D integrated circuits. Proceedings of the conference on Design, automation and test in Europe, 1206-1211. https://doi.org/10.5555/1266366.1266626

Chicago Style (17th ed.) Citation

Mondal, Mosin, Andrew J. Ricketts, Sami Kirolos, Tamer Ragheb, Greg Link, N. Vijaykrishnan, and Yehia Massoud. "Thermally Robust Clocking Schemes for 3D Integrated Circuits." Proceedings of the Conference on Design, Automation and Test in Europe 16 Apr. 2007: 1206-1211. https://doi.org/10.5555/1266366.1266626.

MLA (9th ed.) Citation

Mondal, Mosin, et al. "Thermally Robust Clocking Schemes for 3D Integrated Circuits." Proceedings of the Conference on Design, Automation and Test in Europe, 16 Apr. 2007, pp. 1206-1211, https://doi.org/10.5555/1266366.1266626.