Additive manufacturing of magnetic components for power electronics integration
Yi Yan, Ngo, Khai D. T., Yuhui Mei, Guo-Quan Lu
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Novel processing scheme for embedding and interconnection of ultra-thin IC devices in flexible chip foil packages and recurrent bending reliability analysis
Landesberger, C., Palavesam, N., Hell, W., Drost, A., Faul, R., Gieser, H., Bonfert, D., Bock, K., Kutter, C.
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Thermal cycling lifetime estimation of sintered metal die attachment
Suzuki, Tomohisa, Yasuda, Yusuke, Terasaki, Takeshi, Morita, Toshiaki, Kawana, Yuki, Ishikawa, Dai, Nishimura, Masato, Nakako, Hideo, Kurafuchi, Kazuhiko
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations
Libot, J. B., Arnaud, L., Dalverny, O., Alexis, J., Milesi, P., Dulondel, F.
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Low temperature sintering of silver nanoparticle paste for electronic packaging
Hongqiang Zhang, Guisheng Zou, Lei Liu, Aiping Wu, Zhou, Y. Norman
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Partial discharges in ceramic substrates - correlation of electric field strength simulations with phase resolved partial discharge measurements
Bayer, Christoph Friedrich, Waltrich, Uwe, Soueidan, Amal, Baer, Eberhard, Schletz, Andreas
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
Zhi-Cheng Hsiao, Cheng-Ta Ko, Hsiang-Hung Chang, Huan-Chun Fu, Chia-Wei Chiang, Chao-Kai Hsu, Wen-Wei Shen, Wei-Chung Lo
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Heat transfer analysis in the thermal compression bonding for CoW process
Aasahi, Noboru, Nimura, Masatsugu
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
A low temperature Cu-Cu direct bonding method with VUV and HCOOH treatment for 3D integration
Sakai, Taiji, Imaizumi, Nobuhiro, Sakuyama, Seiki
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Epoxy molding compound for fingerprint sensor
Tabei, Junichi, Sasajima, Hideaki, Mori, Takeshi
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Immersion cooling of electronics utilizing lotus-type porous copper
Yuki, Kazuhisa, Hara, Tomohiro, Ikezawa, Soichiro, Anju, Kentaro, Suzuki, Koichi, Ogushi, Tetsuro, Ide, Takuya, Murakami, Masaaki
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Enhancement of the partial discharge inception voltage of ceramic substrates for power modules by trench coating
Waltrich, U., Bayer, C. F., Reger, M., Meyer, A., Tang, X., Schletz, A.
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST
Ying-Ta Chiu, Tzu-Hsing Chiang, Ping-Feng Yang, Huang, Louie, Chih-Pin Hung, Uegaki, Shoji, Kwang-Lung Lin
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Conduction path development in electrically conductive adhesives composed of an epoxy-based binder
Sakaniwa, Yoshiaki, Iida, Masaki, Tada, Yasunori, Inoue, Masahiro
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Bonding of copper pillars using electroless Ni plating
Sean Yang, Hung, H. T., Chen, Y. B., Kao, C. R.
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Recent trend of package warpage characteristic
Wei Keat Loh, Kulterman, Ron, Purdie, Tim, Fu, Haley, Tsuriya, Masahiro
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Process parameters for formic acid treatment with Pt catalyst for Cu direct bonding
Matsuoka, Naoya, Fujino, Masahisa, Akaike, Masatake, Suga, Tadatomo
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
A novel highly electrically conductive silver paste
Jia-Min Lin, Wei-Nung Chen, Chiao-Yang Lin, Ching-Fen Lin, Jiin-Chyuan Chang
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Electrical characteristics of bumpless interconnects for through silicon via (TSV) and Wafer-On-Wafer (WOW) integration
Kim, Y. S., Kodama, S., Maeda, N., Fujimoto, K., Mizushima, Y., Kawai, A., Hsu, T. C., Tzeng, P., Ku, T. K., Ohba, T.
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding