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56th Electronic Components and Technology Conference (ECTC 2006)
Published in IEEE transactions on advanced packaging
(01.05.2006)
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Journal Article
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56th Electronic Components and Technology Conference (ECTC 2006)
Published in IEEE transactions on components and packaging technologies
(01.09.2005)
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Journal Article
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56th Electronic Components and Technology Conference (ECTC 2006)
Published in IEEE transactions on advanced packaging
(01.08.2005)
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Journal Article
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56th Electronic Components and Packaging Conference (ECPC 2006)
Published in IEEE transactions on electronics packaging manufacturing
(01.04.2006)
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Journal Article
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Third Annual Tin Whisker Workshop Scheduled for May 30 at ECTC; Event co-sponsored by iNEMI, the IEEE CPMT Society and ECTC
Published in Business Wire
(17.04.2006)
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Newsletter
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An embedded device technology based on a molded reconfigured wafer
Brunnbauer, M., Furgut, E., Beer, G., Meyer, T., Hedler, H., Belonio, J., Nomura, E., Kiuchi, K., Kobayashi, K.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Reliability of the aging lead free solder joint
Hongtao Ma, Suhling, J.C., Lall, P., Bozack, M.J.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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A CMOS-compatible process for fabricating electrical through-vias in silicon
Andry, P.S., Tsang, C., Sprogis, E., Patel, C., Wright, S.L., Webb, B.C., Buchwalter, L.P., Manzer, D., Horton, R., Polastre, R., Knickerbocker, J.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
Wright, S.L., Polastre, R., Gan, H., Buchwalter, L.P., Horton, R., Andry, P.S., Sprogis, E., Patel, C., Tsang, C., Knickerbocker, J., Lloyd, J.R., Sharma, A., Sri-Jayantha, M.S.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Stackable thin film multi layer substrates with integrated passive components
Zoschke, K., Buschick, K., Scherpinski, K., Fischer, T., Wolf, J., Ehrmann, O., Jordan, R., Reichl, H., Schmiickle, F.-J.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Interface failure in lead free solder joints
Darveaux, R., Reichman, C., Islam, N.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Copper die bumps (first level interconnect) and low-K dielectrics in 65nm high volume manufacturing
Yeoh, A., Chang, M., Pelto, C., Tzuen-Luh Huang, Balakrishnan, S., Leatherman, G., Agraharam, S., Guotao Wang, Zhiyong Wang, Chiang, D., Stover, P., Brandenburger, P.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Design and process optimization for dual row QFN
Retuta, D.V., Lim, B.K., Tan, H.B.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
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Qualification of Low-k 65nm Technology Die with Pb-free Bumps on a 2-2-2 Laminate Package (PBGA) with Pb-free Assembly Processes
Ray, S., Muncy, J., McLaughlin, P.V., Nicholls, L.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
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A study on package stacking process for package-on-package (PoP)
Yoshida, A., Taniguchi, J., Murata, K., Kada, M., Yamamoto, Y., Takagi, Y., Notomi, T., Fujita, A.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding