Climate-human-landscape interaction in the eastern foothills of Mt. Kilimanjaro (equatorial East Africa) during the last two millennia
van der Plas, Geert W, Rucina, Stephen M, Hemp, Andreas, Marchant, Robert A, Hooghiemstra, Henry, Schüler, Lisa, Verschuren, Dirk
Published in Holocene (Sevenoaks) (01.04.2021)
Published in Holocene (Sevenoaks) (01.04.2021)
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Journal Article
Modular sub-wavelength diffractive light modulator for high-definition holographic displays
Stahl, Richard, Rochus, Veronique, Rottenberg, Xavier, Cosemans, Stefan, Haspeslagh, Luc, Severi, Simone, Plas, Geert Van der, Lafruit, Gauthier, Donnay, Stephane
Published in Journal of physics. Conference series (22.02.2013)
Published in Journal of physics. Conference series (22.02.2013)
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Journal Article
On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing
Civale, Yann, Croes, Kristof, Miyamori, Yuichi, Velenis, Dimitrios, Redolfi, Augusto, Thangaraju, Sarasvathi, Ammel, Annemie Van, Cherman, Vladimir, Plas, Geert Van der, Cockburn, Andrew, Gravey, Virginie, Kumar, Nirajan, Cao, Zhitao, Travaly, Youssef, Tőkei, Zsolt, Beyne, Eric, Swinnen, Bart
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
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Journal Article
Conference Proceeding
A 150 MS/s 133 μW 7 bit ADC in 90 nm Digital CMOS
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Conference Proceeding
Journal Article
Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications
Wei, Tiwei, Oprins, Herman, Cherman, Vladimir, Yang, Zhi, Rivera, Kathryn C., Plas, Geert Van der, Pawlak, Bartlomiej J., England, Luke, Beyne, Eric, Baelmans, Martine
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.03.2021)
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Journal Article
Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement
Elsinger, Georg, Oprins, Herman, Cherman, Vladimir, Van der Plas, Geert, Beyne, Eric, De Wolf, Ingrid
Published in Fluids (Basel) (01.03.2024)
Published in Fluids (Basel) (01.03.2024)
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Journal Article
A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a
Ryckaert, J., Van der Plas, G., De Heyn, V., Desset, C., Van Poucke, B., Craninckx, J.
Published in IEEE journal of solid-state circuits (01.12.2007)
Published in IEEE journal of solid-state circuits (01.12.2007)
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Journal Article
Conference Proceeding
A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication
Ryckaert, J., Verhelst, M., Badaroglu, M., D'Amico, S., De Heyn, V., Desset, C., Nuzzo, P., Van Poucke, B., Wambacq, P., Baschirotto, A., Dehaene, W., Van der Plas, G.
Published in IEEE journal of solid-state circuits (01.11.2007)
Published in IEEE journal of solid-state circuits (01.11.2007)
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Journal Article
Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits
Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Marchal, Paul, Libois, Michael, La Manna, Antonio, Wenqi Zhang, Beyer, Gerald, Beyne, Eric
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.06.2014)
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Journal Article
A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a
Ryckaert, Julien, van der Plas, Geert, de Heyn, Vincent, Desset, Claude, Vanwijnsberghe, Geert, van Poucke, Bart, Craninckx, Jan
Published in 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (01.02.2007)
Published in 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (01.02.2007)
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Conference Proceeding
Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration
Jourdain, Anne, Schleicher, Filip, De Vos, Joeri, Stucchi, Michele, Chery, Emmanuel, Miller, Andy, Beyer, Gerald, Van der Plas, Geert, Walsby, Edward, Roberts, Kerry, Ashraf, Huma, Thomas, Dave, Beyne, Eric
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Modeling of Substrate Noise Generation, Isolation, and Impact for an LC-VCO and a Digital Modem on a Lightly-Doped Substrate
Soens, C., Van der Plas, G., Badaroglu, M., Wambacq, P., Donnay, S., Rolain, Y., Kuijk, M.
Published in IEEE journal of solid-state circuits (01.09.2006)
Published in IEEE journal of solid-state circuits (01.09.2006)
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Journal Article
A fast start-up 3GHz-10GHz digitally controlled oscillator for UWB impulse radio in 90nm CMOS
De Heyn, V., Van der Plas, G., Ryckaert, J., Craninckx, J.
Published in ESSCIRC 2007 - 33rd European Solid-State Circuits Conference (01.09.2007)
Published in ESSCIRC 2007 - 33rd European Solid-State Circuits Conference (01.09.2007)
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Conference Proceeding
Efficient Backside Power Delivery for High-Performance Computing Systems
Lin, Hesheng, van der Plas, Geert, Sun, Xiao, Velenis, Dimitrios, Catthoor, Francky, Lauwereins, Rudy, Beyne, Eric
Published in IEEE transactions on very large scale integration (VLSI) systems (01.11.2022)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.11.2022)
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Journal Article
Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects
Huynen, Martijn, Kapusuz, Kamil Yavuz, Sun, Xiao, Van der Plas, Geert, Beyne, Eric, De Zutter, Daniel, Vande Ginste, Dries
Published in IEEE transactions on microwave theory and techniques (01.04.2020)
Published in IEEE transactions on microwave theory and techniques (01.04.2020)
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Journal Article