Heatsink very-thin quad flat no-leads (HVQFN) package
van Gemert, Leonardus Antonius Elisabeth, Kamphuis, Tonny, Israel, Emil Casey, van der Meulen, Rintje
Year of Publication 24.04.2018
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Year of Publication 24.04.2018
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Exposed-Heatsink quad flat no-leads (QFN) package
EMIL CASEY ISRAEL, TONNY KAMPHUIS, LEONARDUS ANTONIUS ELISABETH VAN GEMERT
Year of Publication 03.02.2016
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Year of Publication 03.02.2016
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Exposed-Heatsink Quad Flat No-Leads (QFN) Package
KAMPHUIS TONNY, VAN GEMERT LEONARDUS ANTONIUS ELISABETH, ISRAEL EMIL CASEY
Year of Publication 07.01.2016
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Year of Publication 07.01.2016
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Die interconnect
LEONARDUS ANTONIUS ELISABETH VAN GEMERT, MARTEN OLDSEN, COENRAAD CORNELIS TAK
Year of Publication 30.09.2015
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Year of Publication 30.09.2015
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HEATSINK VERY-THIN QUAD FLAT NO-LEADS (HVQFN) PACKAGE
Kamphuis Tonny, van Gemert Leonardus Antonius Elisabeth, Israel Emil Casey, van der Meulen Rintje
Year of Publication 26.01.2017
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Year of Publication 26.01.2017
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Reduction of defects in wafer level chip scale package (WLCSP) devices
Swartjes, Franciscus Henrikus Martinus, Kamphuis, Tonny, van Gemert, Leonardus Antonius Elisabeth, Beelen-Hendrikx, Caroline Catharina Maria, Groenhuis, Roelf Anco Jacob, de Witte, Jetse
Year of Publication 08.01.2019
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Year of Publication 08.01.2019
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Die interconnect
TAK COENRAAD CORNELIS, VAN GEMERT LEONARDUS ANTONIUS ELISABETH, BOUMAN HENDRIK, OLDSEN MARTEN
Year of Publication 05.07.2016
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Year of Publication 05.07.2016
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Exposed die quad flat no-leads (qfn) package
EMIL CASEY ISRAEL, ROELF ANCO JACOB GROENHUIS, LEONARDUS ANTONIUS ELISABETH VAN GEMERT
Year of Publication 13.01.2016
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Year of Publication 13.01.2016
Patent
EXPOSED DIE QUAD FLAT NO-LEADS (QFN) PACKAGE
VAN GEMERT LEONARDUS ANTONIUS ELISABETH, ISRAEL EMIL CASEY, GROENHUIS ROELF ANCO JACOB
Year of Publication 07.01.2016
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Year of Publication 07.01.2016
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Protection of a wafer-level chip scale package (WLCSP)
BUENNING HARTMUT, KAMPHUIS TONNY, VAN GEMERT LEONARDUS ANTONIUS ELISABETH, ZENZ CHRISTIAN, MOELLER SASCHA
Year of Publication 24.11.2015
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Year of Publication 24.11.2015
Patent