Research on dental service utilization and untreated conditions among Koreans aged 65 and above
Jang, Ji Eon, Jun, Sung Hee, Jeong, Sun Rak
Published in Journal of Korean Academy of Oral Health (30.12.2023)
Published in Journal of Korean Academy of Oral Health (30.12.2023)
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Journal Article
퇴원손상심층조사 자료를 이용한 영아 병태 및 손상 이환율과 치료 호전율
박혜린, Hye-rin Park, 정선락, Sun-rak Jeong, 신은경, Eun-kyoung Shin, 이원기, Won Kee Lee
Published in 보건정보통계학회지 (30.05.2022)
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Published in 보건정보통계학회지 (30.05.2022)
Journal Article
Simple immunohistochemical staining method using large sized gold colloid conjugated secondary antibody
Lee, Eun Jung, Kim, Yonggoo, Lim, Jihyang, Kim, Myungshin, Kang, Chang Suk, Lee, Jae Hoon, Mok, Rak Sun, Park, Young Nam, Choi, Ha-Young, Han, Kyungja
Published in Annals of clinical and laboratory science (2007)
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Published in Annals of clinical and laboratory science (2007)
Journal Article
2005년부터 2016년까지의 퇴원손상심층조사에서 비사망을 포함한 고의적자해방법과 호전율의 변화추이
김아름, Ah-reum Kim, 정선락, Sun-rak Jeong, 김은석, Eun-seok Kim, 이원기, Won Kee Lee
Published in 보건정보통계학회지 (30.05.2021)
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Published in 보건정보통계학회지 (30.05.2021)
Journal Article
재활요양병원 물리·작업치료사의 직무스트레스, 자기효능감 및 우울
박재우, Jae-woo Park, 정선락, Sun-rak Jeong, 박녕서, Nyeong-seo Park, 이원기, Won Kee Lee
Published in 보건정보통계학회지 (30.11.2020)
Published in 보건정보통계학회지 (30.11.2020)
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Journal Article
Immunochromatographic membrane strip assay system for a single-class plasma lipoprotein cholesterol, exemplified by high-density lipoprotein cholesterol measurement
Paek, S.H, Jang, M.R, Mok, R.S, Kim, S.C, Kim, H.B
Published in Biotechnology and bioengineering (20.01.1999)
Published in Biotechnology and bioengineering (20.01.1999)
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Journal Article
Novel sidewall interconnection using perpendicular circuit die with non-solder bumps for 3D chip stack
Sun-Rak Kim, Il Kim, Jae Hak Lee, Lee, S. S.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Development of inclined conductive bump (ICB) for flip-chip interconnection
Ah-Young Park, Sun-Rak Kim, Yoo, C. D., Taek-Soo Kim
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
An efficient edge traces technique for 3D interconnection of stack chip
Sun-Rak Kim, Ah-Young Park, Yoo, C. D., Jae Hak Lee, Jun-Yeob Song, Lee, S. S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
A study on the edge traces technique for 3D stack chip
Jae Hak Lee, Yoo, C. D., Jun-Yeob Song, Lee, S. S., Sun-Rak Kim
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
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Conference Proceeding