Search Results - "stacking structure" :: K.UTB vyhledávací portál

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Chain-Folded Lamellar Stacking Structure of the Crystalline Fraction of Bombyx mori Silk Fibroin with Silk II Form Studied by 2D 13C–13C Homonuclear Correlation NMR Spectroscopy

by Naito, Akira, Okushita, Keiko, Aoki, Akihiro, Asakura, Tetsuo
Published in The journal of physical chemistry. B (05.09.2024)

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Chain-Folded Lamellar Stacking Structure of the Crystalline Fraction of Bombyx mori Silk Fibroin with Silk II Form Studied by 2D 13 C– 13 C Homonuclear Correlation NMR Spectroscopy

by Naito, Akira, Okushita, Keiko, Aoki, Akihiro, Asakura, Tetsuo
Published in The journal of physical chemistry. B (05.09.2024)

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Journal Article

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Photothermal conversion coating with novel stacking structure

by LIU XIAOPENG, MENG JIANPING, HAO LEI, MI JING, DU MIAO
Year of Publication 01.03.2017

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Patent

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GLASS SUBSTRATE STACKING STRUCTURE, DEVICE AND METHOD FOR FILM COATING PROCESS

by HUANG YEN-YU, CHEN YUNGIEN, KUO CHENG, LIN TZU-PIN
Year of Publication 14.11.2013

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Patent

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Stacking structure of optical panel

by SHE, ZHI-JUN, HUANG, PING-PING, CAI, ZHI-XIONG, JIANG, YAONG
Year of Publication 21.01.2013

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Patent

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Patterning method and stacking structure for patterning

by SU GUOHUI, LIANG SHUOWEI, LAI SHIXIANG, JIANG XINQUAN, WANG MINJI
Year of Publication 21.11.2012

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Patent

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STACKING STRUCTURE OF OPTICAL PANELS AND METHOD FOR MANUFACTURING SAME

by HUANG, PINGPING, SHE, ZHIJUN, CAI, ZHIXIONG, JIANG, YAUCHEN
Year of Publication 23.05.2013

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Patent

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Metal stacking structure of negative electrode of concentrator photovoltaic

by ZHANG, QI-BANG, HUANG, GUO-JUN, WU, ZHENG-DA, GUO, CHUN-WEN
Year of Publication 01.11.2013

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Patent

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Glass substrate stacking structure, apparatus and method for film coating process

by HUANG, YAN YU, CHEN, YUNG CHIEN, LIN, TZU PIN, GUO, JHE CHENG
Year of Publication 01.01.2015

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Patent

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Patterning method and stacking structure for patterning

by SU GUOHUI, LIANG SHUOWEI, LAI SHIXIANG, JIANG XINQUAN, WANG MINJI
Year of Publication 26.01.2011

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Patent

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Glass substrate stacking structure, apparatus and method for film coating process

by CHEN, YUNGIEN, HUANG, YAN-YU, LIN, TZU-PIN, GUO, JHENG
Year of Publication 16.11.2013

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Patent

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Hydrocarbon reforming device using micro channel heater with stacking structure

Year of Publication 11.06.2013

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Patent

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Hydrocarbon reforming device using micro channel heater with stacking structure

Year of Publication 19.11.2012

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Patent

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Solar cell of non-cascade type stacking structure and manufacturing method thereof

by CAI, WEI-ZHI, WANG, SHUI-JIN, CENG, ZHI-REN
Year of Publication 01.12.2010

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Patent

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Pallet for coiled carrying article, loading structure for loading coiled carrying article on pallet, stacking structure for stacking carrying article loading pallets and method for using the same, containing structure for containing stacked coiled

by ITOU, NOBUAKI, AOKI, TATSUHIKO, KATO, NOBUHIRO
Year of Publication 01.08.2005

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Patent

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Coil-like transport subject pallet, structure for loading the subject onto pallet, and method for transporting the subject; stacking structure for stacking transport subject loading pallet and method for using the therefore, etc

by ITOU, NOBUAKI, AOKI, TATSUHIKO, KATO, NOBUHIRO
Year of Publication 01.10.2004

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Patent

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A Moisture‐Proof, Anti‐Fouling, and Low Signal Attenuation All‐Nanofiber Triboelectric Sensor for Self‐Powered Respiratory Health Monitoring

by Chen, Xiao, Peng, Xiao, Wei, Chuanhui, Wang, Zixun, He, Jin, Sheng, Hengrui, Jiang, Tao, Dong, Kai
Published in Advanced functional materials (01.02.2025)

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Journal Article

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The effect of imbrication on the porosity value of uniform gravel bed

by Xu, Wenjia, Brüll, Catrina, Schüttrumpf, Holger, Frings, Roy M., Vollmer, Stefan
Published in Granular matter (01.11.2024)

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Stacking order and driving forces in the layered charge density wave phase of 1T-MX2 (M = Nb, Ta and X = S, Se)

by Zhang, Wenjun, Wu, Jiansheng
Published in Materials research express (01.04.2023)

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Journal Article

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Multi-Stack Wafer Bonding Demonstration utilizing Cu to Cu Hybrid Bonding and TSV enabling Diverse 3D Integration

by Kim, TaeSeong, Cho, Sohye, Hwang, SeonKwan, Lee, Kyuha, Hong, Yikoan, Lee, Hakseung, Cho, Hyokyung, Moon, Kwangjin, Na, Hoonjoo, Hwang, Kihyun
Published in Proceedings / Electronic Components Conference (01.06.2021)

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