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Benefit allocation of electricity–gas–heat–hydrogen integrated energy system based on Shapley value
Liu, Yujiao, Li, Yan, Rong, Yiping, Li, Guoliang, Wang, Ruiqi, Zhou, Haini
Published in Clean energy (Online) (01.12.2023)
Published in Clean energy (Online) (01.12.2023)
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Journal Article
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(Invited) Self Healing Interconnects for Reliable Flexible Electronics
Sambandan, Sanjiv, Kumar, Amit, Yaswant, Vaddi, Parab, Virendra
Published in Meeting abstracts (Electrochemical Society) (13.04.2018)
Published in Meeting abstracts (Electrochemical Society) (13.04.2018)
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Journal Article
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Vehicle torque control method in accordance with functional safety requirements
LI YANWEN, RONG HUI, LIU BOYU, GAO JIDONG, LI HONGPENG, SUN CHEN, ZHU ZHONGWEN, GONG JINFENG, LI BO, XI WENXIA
Year of Publication 04.05.2018
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Year of Publication 04.05.2018
Patent
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Copper wire bond pad/IMC interfacial layer crack study during HTSL (high temperature storage life) test
Mingchuan Han, Miao Wang, Lidong Zhang, Beiyue Yan, Jun Li, Meijiang Song, Mathew, Varughese
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
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The role of Cu-Al IMC coverage and aluminum splash in Pd-copper wire HAST performance
Ming-chuan Han, Jun Li, Bei-Yue Yan, Yao, J. Z., Mei-Jiang Song
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding