Loading…
Challenges of Scaling Down High-Power Performance Flip Chip Ball Grid Array (FCBGA) Package
Chan, W H, Lakhera, Nishant, Uehling, Trent, Bharatham, Logendran, Shantaram, Sandeep, Sukemi, Azham Mohd
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Get full text
Conference Proceeding
Loading…
Loading…
Loading…
Loading…
Loading…
Loading…
Loading…
Loading…
Loading…
Lithium Secondary Battery of High Power Property with Improved High Energy Density
Year of Publication 03.12.2012
Get full text
Patent
Loading…
Loading…
Loading…