Epitaxial diamond-hexagonal silicon nano-ribbon growth on (001) silicon
Qiu, Y., Bender, H., Richard, O., Kim, M.-S., Van Besien, E., Vos, I., de Potter de ten Broeck, M., Mocuta, D., Vandervorst, W.
Published in Scientific reports (04.08.2015)
Published in Scientific reports (04.08.2015)
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Journal Article
Active-lite interposer for 2.5 & 3D integration
Hellings, G., Scholz, M., Detalle, M., Velenis, D., de Potter de ten Broeck, M., Roda Neve, C., Li, Y., Van Huylenbroek, S., Chen, S.-H, Marinissen, E.-J, La Manna, A., Van der Plas, G., Linten, D., Beyne, E., Thean, A.
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
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Conference Proceeding
Journal Article
Dose Enhancement Due to Interconnects in Deep-Submicron MOSFETs Exposed to X-Rays
Griffoni, A., Silvestri, M., Gerardin, S., Meneghesso, G., Paccagnella, A., Kaczer, B., de Potter de ten Broeck, M., Verbeeck, R., Nackaerts, A.
Published in IEEE transactions on nuclear science (01.08.2009)
Published in IEEE transactions on nuclear science (01.08.2009)
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Journal Article
CMOS Compatible Anodization Process for Low Cost High Density Capacitors
Detalle, Mikael, Rakowski, Michal, Potoms, Goedele, Mercha, Abdelkarim, De Potter de ten Broeck, Muriel, Phommahaxay, Alain, Sabuncuoglu Tezcan, Deniz, Soussan, Philippe
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology
Van der Plas, G, Limaye, P, Loi, I, Mercha, A, Oprins, H, Torregiani, C, Thijs, S, Linten, D, Stucchi, M, Katti, G, Velenis, D, Cherman, V, Vandevelde, B, Simons, V, De Wolf, I, Labie, R, Perry, D, Bronckers, S, Minas, N, Cupac, M, Ruythooren, W, Van Olmen, J, Phommahaxay, A, de Potter de ten Broeck, M, Opdebeeck, A, Rakowski, M, De Wachter, B, Dehan, M, Nelis, M, Agarwal, R, Pullini, A, Angiolini, F, Benini, L, Dehaene, W, Travaly, Y, Beyne, E, Marchal, P
Published in IEEE journal of solid-state circuits (01.01.2011)
Published in IEEE journal of solid-state circuits (01.01.2011)
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Conference Proceeding
Active-lite interposer for 2.5 & 3D integration
Hellings, G., Scholz, M., Detalle, M., Velenis, D., de Potter de ten Broeck, M., Neve, C. Roda, Li, Y., Van Huylenbroek, S., Chen, S.-H, Marinissen, E.-J, La Manna, A., Van der Plas, G., Linten, D., Beyne, E., Thean, A.
Published in 2015 Symposium on VLSI Circuits (VLSI Circuits) (01.06.2015)
Published in 2015 Symposium on VLSI Circuits (VLSI Circuits) (01.06.2015)
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Conference Proceeding
Journal Article
Optimization of low temperature silicon nitride processes for improvement of device performance
Sleeckx, E., Schaekers, M., Shi, X., Kunnen, E., Degroote, B., Jurczak, M., de Potter de ten Broeck, M., Augendre, E.
Published in Microelectronics and reliability (01.05.2005)
Published in Microelectronics and reliability (01.05.2005)
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Journal Article
Conference Proceeding
Design issues and considerations for low-cost 3D TSV IC technology
Van der Plas, G., Limaye, P., Mercha, A., Oprins, H., Torregiani, C., Thijs, S., Linten, D., Stucchi, M., Guruprasad, K., Velenis, D., Shinichi, D., Cherman, V., Vandevelde, B., Simons, V., De Wolf, I., Labie, R., Perry, D., Bronckers, S., Minas, N., Cupac, M., Ruythooren, W., Van Olmen, J., Phommahaxay, A., de Potter de ten Broeck, M., Opdebeeck, A., Rakowski, M., De Wachter, B., Dehan, M., Nelis, M., Agarwal, R., Dehaene, W., Travaly, Y., Marchal, P., Beyne, E.
Published in 2010 IEEE International Solid-State Circuits Conference - (ISSCC) (01.02.2010)
Published in 2010 IEEE International Solid-State Circuits Conference - (ISSCC) (01.02.2010)
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Conference Proceeding
Methodology for characterizing the impact of circuit layout, technology options, device engineering and temperature on the circuit power-delay characteristics
Chiarella, T., Ramos, J., Nackaerts, A., Demuynck, S., Verhaegen, S., Verbeeck, R., de Potter de ten Broeck, M., Kerner, C., Hoffmann, T., Van Hove, M., Debusschere, I., Biesemans, S.
Published in 2006 IEEE International Conference on Microelectronic Test Structures (2006)
Published in 2006 IEEE International Conference on Microelectronic Test Structures (2006)
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Conference Proceeding
3D stacked IC demonstration using a through Silicon Via First approach
Van Olmen, J., Mercha, A., Katti, G., Huyghebaert, C., Van Aelst, J., Seppala, E., Zhao Chao, Armini, S., Vaes, J., Teixeira, R.C., Van Cauwenberghe, M., Verdonck, P., Verhemeldonck, K., Jourdain, A., Ruythooren, W., de Potter de ten Broeck, M., Opdebeeck, A., Chiarella, T., Parvais, B., Debusschere, I., Hoffmann, T.Y., De Wachter, B., Dehaene, W., Stucchi, M., Rakowski, M., Soussan, P., Cartuyvels, R., Beyne, E., Biesemans, S., Swinnen, B.
Published in 2008 IEEE International Electron Devices Meeting (01.12.2008)
Published in 2008 IEEE International Electron Devices Meeting (01.12.2008)
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Conference Proceeding
Thin L-shaped spacers for CMOS devices
Augendre, E., Rooyackers, R., de Potter de ten Broeck, M., Kunnen, E., Beckx, S., Mannaert, G., Vrancken, C., Vassilev, V., Chiarella, T., Jurczak, M., Debusschere, I.
Published in ESSDERC '03. 33rd Conference on European Solid-State Device Research, 2003 (2003)
Published in ESSDERC '03. 33rd Conference on European Solid-State Device Research, 2003 (2003)
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Conference Proceeding
Dose enhancement due to interconnects in deep-submicron MOSFETs exposed to X-rays
Griffoni, A, Silvestri, M, Gerardin, S, Meneghesso, G, Paccagnella, A, Kaczer, B, de Potter de ten Broeck, M, Verbeeck, R, Nackaerts, A
Published in 2008 European Conference on Radiation and Its Effects on Components and Systems (01.09.2008)
Published in 2008 European Conference on Radiation and Its Effects on Components and Systems (01.09.2008)
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Conference Proceeding