Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
Sprenger, Mario, Noll, Niklas, Hecht, Christoph, de Greiff, Malte, Muller, Lars, Franke, Jorg
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Halbleitermodul
Mader, Martin, Greiff, Malte De, Gottschalk, Michael, Müllmaier, Michael
Year of Publication 28.07.2022
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Year of Publication 28.07.2022
Patent
Schaltungsanordnung
Böhmer, Janis, Greiff, Malte De, Gottschalk, Michael, Müllmaier, Michael
Year of Publication 02.12.2021
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Year of Publication 02.12.2021
Patent