Electro-mechanical studies of micro-tube insertion into Al–Cu pads for 10μm pitch interconnection technology and 3D applications
Goubault de Brugière, B., Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.
Published in Microelectronic engineering (01.07.2013)
Published in Microelectronic engineering (01.07.2013)
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Journal Article
Conference Proceeding
A 10μm pitch interconnection technology using micro tube insertion into Al-Cu for 3D applications
de Brugiere, B. G., Marion, F., Fendler, M., Mandrillon, V., Hazotte, A., Volpert, M., Ribot, H.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Micro tube insertion into indium, copper and other materials for 3D applications
de Brugière, B Goubault, Marion, F, Fendler, M, Mandrillon, V, Hazotte, A, Volpert, M, Ribot, H
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Aluminum to Aluminum bonding at room temperature
Marion, F., de Brugiere, B. Goubault, Bedoin, A., Volpert, M., Berger, F., Gueugnot, A., Anciant, R., Ribot, H.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding