An OpenFlow-based performance-oriented multipath forwarding scheme in datacenters
Liu, Bo, Chen, Ming, Xu, Bo, Hu, Hui, Hu, Chao, Zuo, Qing-yun, Xing, Chang-you
Published in Frontiers of information technology & electronic engineering (01.07.2016)
Published in Frontiers of information technology & electronic engineering (01.07.2016)
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Journal Article
Voidless metal filling and elimination of metal diffusion in PVD barrier and seed process for high performance Cu interconnect
Hu, Zheng-Jun, Qu, Xin-Ping, Lin, Hong, Zuo, Qing-Yun, Wang, Wei-Jun, Li, Ming, Chen, Shou-Mian, Zhao, Yu-Hang
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
Published in 2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2018)
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Conference Proceeding
CU seed, CMP process development and via resistance extraction in through silicon via technology
Zheng-Jun Hu, Xin-Ping Qu, Hong Lin, Ren-Dong Huang, Qing-Yun Zuo, Ming Li, Shou-Mian Chen, Yu-Hang Zhao
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
Published in 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (01.10.2014)
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Conference Proceeding