Pressing Simulations within the PCB Manufacturing Framework
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Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
Published in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (25.04.2022)
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Conference Proceeding
A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
Kamble, Vikram G, Patel, Dhaval Rasheshkumar, Schipfer, Christian, Thalhamer, Andreas, Zuendel, Julia, Krivec, Thomas, Antretter, Thomas, Fuchs, Peter Filipp
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
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Conference Proceeding
EVALUATING THE HEALTH CONDITION OF A SINGLE COMPONENT CARRIER
KRIVEC, Thomas, GALLER, Christian, WEIS, Gerald, STUBENBERGER, Gerhard, ZUENDEL, Julia, FENDT, Karl Thomas
Year of Publication 10.05.2024
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Year of Publication 10.05.2024
Patent
EVALUATING THE HEALTH CONDITION OF A SINGLE COMPONENT CARRIER
Weis, Gerald, Galler, Christian, Stubenberger, Gehard, Krivec, Thomas, Zuendel, Julia, Fendt, Karl Thomas
Year of Publication 08.05.2024
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Year of Publication 08.05.2024
Patent