Calorimetric measurements of undercooling in single micron sized SnAgCu particles in a wide range of cooling rates
Gao, Y.L., Zhuravlev, E., Zou, C.D., Yang, B., Zhai, Q.J., Schick, C.
Published in Thermochimica acta (01.01.2009)
Published in Thermochimica acta (01.01.2009)
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Journal Article
Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles
Zou, C.D, Gao, Y.L, Yang, B, Zhai, Q.J, Andersson, C, Liu, J
Published in Soldering & surface mount technology (01.01.2009)
Published in Soldering & surface mount technology (01.01.2009)
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Journal Article
Repeated nucleation in an undercooled tin droplet by fast scanning calorimetry
Yang, B., Gao, Y.L., Zou, C.D., Zhai, Q.J., Zhuravlev, E., Schick, C.
Published in Materials letters (30.11.2009)
Published in Materials letters (30.11.2009)
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Journal Article
Melting temperature depression of Sn0.4Co0.7Cu leadfree solder nanoparticles
Zou, C.D., Gao, Y.L., Yang, B., Zhai, Q.J., Andersson, C., Liu, J.
Published in Soldering & surface mount technology (10.04.2009)
Published in Soldering & surface mount technology (10.04.2009)
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Journal Article