by Colgan, E.G., Furman, B., Gaynes, M., Graham, W.S., LaBianca, N.C., Magerlein, J.H., Polastre, R.J., Rothwell, M.B., Bezama, R.J., Choudhary, R., Marston, K.C., Toy, H., Wakil, J., Zitz, J.A., Schmidt, R.R.
Published in IEEE transactions on components and packaging technologies (01.06.2007)

by Knickerbocker, J. U., Pompeo, F. L., Tai, A. F., Thomas, D. L., Weekly, R. D., Nealon, M. G., Hamel, H. C., Haridass, A., Humenik, J. N., Shelleman, R. A., Reddy, S. N., Prettyman, K. M., Fasano, B. V., Ray, S. K., Lombardi, T. E., Marston, K. C., Coico, P. A., Brofman, P. J., Goldmann, L. S., Edwards, D. L., Zitz, J. A., Iruvanti, S., Shinde, S. L., Longworth, H. P.
Published in IBM journal of research and development (01.11.2002)

by Wolpert, D., Behnen, E., Sigal, L., Chan, Y., Tellez, G. E., Bradley, D., Serton, R., Veerabhadraiah, R., Ansley, W., Bianchi, A., Dhanwada, N., Lee, S., Scheuermann, M., Wiedemeier, G., Davis, J., Werner, T., Darden, L., Barkley, K., Gray, M., Guzowski, M., DeHond, M., Schell, T., Tsapepas, S., Phan, D., Acharya, K., Zitz, J. A., Shi, H. F., Berry, C., Warnock, J., Wood, M. H., Averill, R. M.
Published in IBM journal of research and development (01.03.2018)

by Goth, G. F., Arvelo, A., Eagle, J., Ellsworth, Michael J., Marston, K. C., Sinha, A. K., Zitz, J. A.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)