High-voltage, double-gate devices on silicon-on-insulator
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Conference Proceeding
Comparative tests for lead-free solder bumps
Zingg, Rene, Geelhaar, Ricardo, Myat, Chan, Struwe, Armin, Krastev, Evstatin
Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
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Published in 2015 European Microelectronics Packaging Conference (EMPC) (01.09.2015)
Conference Proceeding
Reliability of power transistors against application driven temperature swings
Gopalan, Sudha, Krabbenborg, Benno, Egbers, Jan-Hein, van Velzen, Bart, Zingg, Rene
Published in Microelectronics and reliability (01.09.2002)
Published in Microelectronics and reliability (01.09.2002)
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Manufacturability of 3D-epitaxial-lateral-overgrowth CMOS circuits with three stacked channels
Roos, Gerhard, Hoefflinger, Bernd, Schubert, Martin, Zingg, René
Published in ESSDERC '91: 21st European Solid State Device Research Conference (1991)
Published in ESSDERC '91: 21st European Solid State Device Research Conference (1991)
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