High temperature automotive application: A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology
Eu Poh Leng, Poh Zi Song, Au Yin Kheng, Yong, C C, Tran Tu Anh, Arthur, J, Downey, H, Mathew, V, Chee Yit Yin
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Mold process development of C90 LowK and ultra-finepitch BGA for robust reliability performance
Ibrahim, R., Boon-Yew Low, Zi-Song Poh
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
BGA packaging using insulated wire for die area reduction
Kumar, Shailesh, Garg, Vikas, Verma, Chetan, Bhooshan, Rishi, Poh Zi-Song, Tan, L. C.
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Influence of plasma cleaning on silicon die back adhesion performance
Yeqing Su, Xiao Wei, Cindy Hu, Jiang, Y.W., Poh Zi-Song
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
A study on fine pitch Au and Cu WB integrity vs. Ni thickness of Ni/Pd/Au bond pad on C90 low k wafer technology for high temperature automotive
Eu Poh Leng, Poh Zi Song, Au Yin Kheng, Yong, C C, Anh Tran Tu, Arthur, J, Downey, H, Mathew, V, Chee Yit Yin
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Universal BGA substrate
Lo Wai Yew, Poh Zi Song, Foong Chee Seng, Khoo Ly Hoon, Koh Wen Shi, Yow Kai Yun
Year of Publication 04.07.2017
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Year of Publication 04.07.2017
Patent
Investigation of bond pad etching chemistries for passivation crack
Ibrahim, Rusli, Leoni, Michael, Au Yin Kheng, Kenny, Poh Zi Song, Poh Leng Eu
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Method of forming pillar bump
POH ZI SONG, FOONG CHEE SENG, KALANDAR NAVAS KHAN ORATTI, NGION LEE FEE
Year of Publication 08.12.2015
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Year of Publication 08.12.2015
Patent
UNIVERSAL BGA SUBSTRATE
POH ZI SONG, FOONG CHEE SENG, YOW KAI YUN, KOH WEN SHI, KHOO LY HOON, LO WAI YEW
Year of Publication 02.03.2017
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Year of Publication 02.03.2017
Patent
LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
POH ZI SONG, TENG SENG KIONG, IBRAHIM MOHD RUSLI, LYE MENG KONG, MUNIANDY KESYAKUMAR V.C, AU YIN KHENG
Year of Publication 25.08.2011
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Year of Publication 25.08.2011
Patent