A comparison of polymers and solder alloys by reliability tests on multi-layer redistribution lines in Fan Out Wafer Level Package
Hong-Da Chang, Jay Hsiao, Liu, Kenny, Hsu, H. S., You, Andrew, Ding, Carter, Pagala, Soriente Joshua, Zhu, Tammy, Chang, Ivan, Jiang, James, Cheng-An Chang, Sun, Tommy, Pan, George, Kao, Nicholas, Jase Jiang
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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