Electrostatic BEM for MEMS with thin conducting plates and shells
Bao, Zhongping, Mukherjee, Subrata
Published in Engineering analysis with boundary elements (01.12.2004)
Published in Engineering analysis with boundary elements (01.12.2004)
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Journal Article
Exploration of the design space of wafer level packaging through numerical simulation
Zhongping Bao, Burrell, J., Keser, B., Yadav, P., Kalchuri, S., Zang, Ricky
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Nonlinear mechanics of MEMS plates with a total Lagrangian approach
Mukherjee, Subrata, Bao, Zhongping, Roman, Max, Aubry, Nadine
Published in Computers & structures (01.04.2005)
Published in Computers & structures (01.04.2005)
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Journal Article