Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
Zhmurkin, D. V., Gross, T. S., Buchwalter, L. P.
Published in Journal of electronic materials (01.07.1997)
Published in Journal of electronic materials (01.07.1997)
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Journal Article
Interfacial sliding in Cu/Ta/polymide high density interconnects as a result of thermal cycling
Zhmurkin, D V, Gross, T S, Buchwalter, L P
Published in Journal of electronic materials (01.07.1997)
Get full text
Published in Journal of electronic materials (01.07.1997)
Journal Article
Thermomechanical deformation of 1 mu m thick Cu-polymide line arrays studied by scanning probe microscopy
Zhmurkin, D V, Gross, T S, Buchwalter, L P, Kaufman, F B
Published in Journal of electronic materials (01.01.1996)
Get full text
Published in Journal of electronic materials (01.01.1996)
Journal Article