An Enhanced Augmented Electric-Field Integral Equation Formulation for Dielectric Objects
Tian Xia, Hui Gan, Wei, Michael, Weng Cho Chew, Braunisch, Henning, Zhiguo Qian, Aygun, Kemal, Aydiner, Alaeddin
Published in IEEE transactions on antennas and propagation (01.06.2016)
Published in IEEE transactions on antennas and propagation (01.06.2016)
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Journal Article
An Integral Equation Modeling of Lossy Conductors With the Enhanced Augmented Electric Field Integral Equation
Tian Xia, Hui Gan, Wei, Michael, Weng Cho Chew, Braunisch, Henning, Zhiguo Qian, Aygun, Kemal, Aydiner, Alaeddin
Published in IEEE transactions on antennas and propagation (01.08.2017)
Published in IEEE transactions on antennas and propagation (01.08.2017)
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Journal Article
Mitigating Crosstalk in Unterminated Channels
Braunisch, Henning, Elsherbini, Adel, Zhiguo Qian
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
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Journal Article
Transient Simulation of Multiscale Structures Using the Nonconformal Domain Decomposition Laguerre-FDTD Method
Ming Yi, Zhiguo Qian, Aydiner, Alaeddin, Swaminathan, Madhavan
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2015)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2015)
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Journal Article
Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect
Mahajan, Ravi, Sankman, Robert, Patel, Neha, Dae-Woo Kim, Aygun, Kemal, Zhiguo Qian, Mekonnen, Yidnekachew, Salama, Islam, Sharan, Sujit, Iyengar, Deepti, Mallik, Debendra
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level
Das Sharma, Debendra, Pasdast, Gerald, Qian, Zhiguo, Aygun, Kemal
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2022)
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Journal Article
Structure and solvent effect on the photostability of indolenine cyanine dyes
Chen, Ping, Sun, Shuqing, Hu, Yunfeng, Qian, Zhiguo, Zheng, Deshui
Published in Dyes and pigments (1999)
Published in Dyes and pigments (1999)
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Journal Article
Study on the photooxidation of a near-infrared-absorbing benzothiazolone cyanine dye
Chen, Ping, Li, Jun, Qian, Zhiguo, Zheng, Deshui, Okasaki, Tsuneki, Hayami, Masaaki
Published in Dyes and pigments (01.05.1998)
Published in Dyes and pigments (01.05.1998)
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Journal Article
Embedded Multidie Interconnect Bridge-A Localized, High-Density Multichip Packaging Interconnect
Mahajan, Ravi, Qian, Zhiguo, Viswanath, Ram S., Srinivasan, Sriram, Aygun, Kemal, Jen, Wei-Lun, Sharan, Sujit, Dhall, Ashish
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2019)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2019)
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Journal Article
Electrical, Mechanical, Assembly, and Reliability Enabling for 224 Gbps Package Technologies
Ye, Duye, Geyik, Cemil S., Qian, Zhiguo, Walczyk, Joe, Kedlaya, Vinayak, Schuldes, Jesus Gerardo Reyes, Aygun, Kemal
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2024)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (2024)
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Journal Article
2-D non-conformal domain decomposition using the Laguerre-FDTD scheme
Ming Yi, Swaminathan, Madhavan, Zhiguo Qian, Aydiner, Alaeddin
Published in 2014 IEEE Antennas and Propagation Society International Symposium (APSURSI) (01.07.2014)
Published in 2014 IEEE Antennas and Propagation Society International Symposium (APSURSI) (01.07.2014)
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Conference Proceeding
Memory efficient Laguerre-FDTD scheme for dispersive media
Ming Yi, Swaminathan, Madhavan, Myunghyun Ha, Zhiguo Qian, Aydiner, Alaeddin
Published in 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2013)
Published in 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2013)
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Conference Proceeding
Skin effect modeling of interconnects using the Laguerre-FDTD scheme
Ming Yi, Swaminathan, M., Zhiguo Qian, Aydiner, A.
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding
A full wave conductor modeling using augmented electric field integral equation
Tian Xia, Hui Gan, Wei, Michael, Qin Liu, Lijun Jiang, Weng Cho Chew, Braunisch, Henning, Aygun, Kemal, Zhiguo Qian, Aydiner, Alaeddin
Published in 2016 URSI International Symposium on Electromagnetic Theory (EMTS) (01.08.2016)
Published in 2016 URSI International Symposium on Electromagnetic Theory (EMTS) (01.08.2016)
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Conference Proceeding
An augmented electric field integral equation formulation for dielectrics and conductors at low frequencies
Tian Xia, Hui Gan, Wei, Michael, Weng Cho Chew, Braunisch, Henning, Zhiguo Qian, Aygun, Kemal, Aydiner, Alaeddin
Published in 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (01.03.2015)
Published in 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity (01.03.2015)
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Conference Proceeding
Design of 224Gb/s DSP-Based Transceiver in CMOS Technology: Signal Integrity, Architecture, Circuits, and Packaging
Kim, Jihwan, Cohen, Ariel, Li, Mike Peng, Balankutty, Ajay, Kundu, Sandipan, Khairi, Ahmad, Krupnik, Yoel, Segal, Yoav, Cusmai, Marco, Lazar, Dror, Gordon, Ari, Familia, Noam, Yu, Kai, Liu, Yutao, Beach, Matthew, Wali, Priya, Wu, Hsinho, Shimanouchi, Masashi, Jiang, Jenny Xiaohong, Qian, Zhiguo, Aygun, Kemal, Levin, Itamar, O'Mahony, Frank
Published in 2024 IEEE Custom Integrated Circuits Conference (CICC) (21.04.2024)
Published in 2024 IEEE Custom Integrated Circuits Conference (CICC) (21.04.2024)
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Conference Proceeding
Augmented EPA with augmented EFIE method for packaging analysis
Zuhui Ma, Lijun Jiang, Wengcho Chew, Maokun Li, Zhiguo Qian
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
Published in 2010 IEEE Electrical Design of Advanced Package & Systems Symposium (01.12.2010)
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Conference Proceeding