A study of 28nm back end of line (BEOL) Cu/Ultra-low-k time dependent dielectric breakdown (TDDB) dependence on key processes
Feng-Lian Li, Jie Zhou, Li-Fei Zhang, Zheng-Hao Gan, Xiao-Dong Zou, Tao Dou, Tzu-Chiang Yu
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
Published in 2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2017)
Get full text
Conference Proceeding
Applying Uniform Design of Experiment in Tri-Layer-Based Trench Etch for EM Lifetime Performance Enhancement
Zhou, Jun-Qing, Yang, Siyuan Frank, Wang, Xin-Peng, Hu, Min-Da, Wang, Dong-Jiang, Zhang, Cheng-Long, Cao, Yi-Bin, Gan, Zheng-Hao, Zhang, Hai-Yang
Published in ECS transactions (01.01.2013)
Published in ECS transactions (01.01.2013)
Get full text
Journal Article