Dual stage modeling of moisture absorption and desorption in epoxy mold compounds
Placette, Mark D., Fan, Xuejun, Zhao, Jie-Hua, Edwards, Darvin
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
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Journal Article
Comprehensive landscape of the IPAF inflammasomes in pan-cancer: A bulk omics research and single-cell sequencing validation
Dong, Chen-cheng, Zhang, Qiu-huan, Zhang, Yan, Zhang, Yujie, Ruan, Hanyi, Qin, Tianyu, Zhao, Jie-hua, Wu, Guo, Zhu, Zhou, Yang, Jian-rong
Published in Computers in biology and medicine (01.03.2023)
Published in Computers in biology and medicine (01.03.2023)
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Journal Article
Characterization of the Viscoelasticity of Molding Compounds in the Time Domain
Chae, Seung-Hyun, Zhao, Jie-Hua, Edwards, Darvin R., Ho, Paul S.
Published in Journal of electronic materials (01.04.2010)
Published in Journal of electronic materials (01.04.2010)
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Journal Article
Mechanical integrity evaluation of low-k device with bump shear
PENG SU, ZHAO, Jie-Hua, POZDER, Scott, WONTOR, David
Published in Journal of electronic materials (01.05.2006)
Published in Journal of electronic materials (01.05.2006)
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Journal Article
Microstructure-Based Stress Modeling of Tin Whisker Growth
Jie-Hua Zhao, Peng Su, Min Ding, Chopin, S., Ho, P.S.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2006)
Published in IEEE transactions on electronics packaging manufacturing (01.10.2006)
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Journal Article
Neutral and negative donors in quantum dots
Zhu, Jia-Lin, Zhao, Jie-Hua, Xiong, Jia-Jiong
Published in Journal of physics. Condensed matter (04.07.1994)
Published in Journal of physics. Condensed matter (04.07.1994)
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Journal Article
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 23.01.2024
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Year of Publication 23.01.2024
Patent
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 31.03.2023
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Year of Publication 31.03.2023
Patent
Low dielectric constant materials for advanced interconnects
Morgen, Michael, Zhao, Jie-Hua, Hu, Chuan, Cho, Taiheui, Ho, Paul S., Todd, E.
Published in JOM (1989) (01.09.1999)
Published in JOM (1989) (01.09.1999)
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Journal Article
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 04.10.2022
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Year of Publication 04.10.2022
Patent
Reliability issues for flip-chip packages
Ho, Paul S., Wang, Guotao, Ding, Min, Zhao, Jie-Hua, Dai, Xiang
Published in Microelectronics and reliability (01.05.2004)
Published in Microelectronics and reliability (01.05.2004)
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Journal Article
LOW DIELECTRIC CONSTANT MATERIALS FOR ULSI INTERCONNECTS
Morgen, Michael, Ryan, E. Todd, Zhao, Jie-Hua, Hu, Chuan, Cho, Taiheui, Ho, Paul S
Published in Annual review of materials science (01.08.2000)
Published in Annual review of materials science (01.08.2000)
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Journal Article
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
KILIC BAHATTIN, DABRAL SANJAY, RYU SUK KYU, ZHAO JIE HUA, HU KUNZHONG
Year of Publication 13.09.2021
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Year of Publication 13.09.2021
Patent