Effects of a broadleaf-oriented transformation of coniferous plantations on the hydrological characteristics of litter layers in subtropical China
Bai, Yunxing, Zhou, Yunchao, Du, Jiaojiao, Zhang, Xunyuan, Di, Ni
Published in Global ecology and conservation (01.01.2021)
Published in Global ecology and conservation (01.01.2021)
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Journal Article
Co Liner Impact on Microstructure of Cu Interconnects
Zhang, Xunyuan, Cao, Linjun, Ryan, Vivian, Ho, Paul S., Taylor, Bill, Witt, Christian, Labelle, Cathy
Published in ECS journal of solid state science and technology (01.01.2015)
Published in ECS journal of solid state science and technology (01.01.2015)
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Journal Article
Corrigendum to “Tree species identity affects nutrient accumulation and stoichiometric in soil aggregates in mixed plantations of subtropical China” [CATENA 236 (2024) 107752]
Bai, Yunxing, Zhou, Yunchao, Du, Jiaojiao, Zhang, Xunyuan
Published in Catena (Giessen) (01.07.2024)
Published in Catena (Giessen) (01.07.2024)
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Journal Article
Tree species identity and mixing ratio affected the release of several metallic elements from mixed litter in coniferous-broadleaf plantations in subtropical China
Bai, Yunxing, Zhou, Yunchao, An, Zhengfeng, Du, Jiaojiao, Zhang, Xunyuan, Chang, Scott X.
Published in The Science of the total environment (10.09.2022)
Published in The Science of the total environment (10.09.2022)
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Journal Article
Ruthenium interconnect resistivity and reliability at 48 nm pitch
Xunyuan Zhang, Huai Huang, Patlolla, Raghuveer, Wei Wang, Mont, Frank W., Juntao Li, Chao-Kun Hu, Liniger, Eric G., McLaughlin, Paul S., Labelle, Cathy, Ryan, E. Todd, Canaperi, Donald, Spooner, Terry, Bonilla, Griselda, Edelstein, Daniel
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
Tree species composition alters the decomposition of mixed litter and the associated microbial community composition and function in subtropical plantations in China
Bai, Yunxing, Zhou, Yunchao, Chen, Xinli, An, Zhengfeng, Zhang, Xunyuan, Du, Jiaojiao, Chang, Scott X.
Published in Forest ecology and management (01.02.2023)
Published in Forest ecology and management (01.02.2023)
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Journal Article
Cobalt interconnect on same copper barrier process integration at the 7nm node
Mont, Frank W., Xunyuan Zhang, Wei Wang, Kelly, James J., Standaert, Theodorus E., Quon, Roger, Ryan, E. Todd
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
Middle of line RC performance study at the 7 nm node
Fan, Susan Su-Chen, Chen, James Hsueh-Chung, Kamineni, Vimal Kumar, Xunyuan Zhang, Raymond, Mark, Labelle, Cathy
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
Methods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond
Xunyuan Zhang, Huai Huang, Patlolla, Raghuveer, Mont, Frank W., Xuan Lin, Raymond, Mark, Labelle, Cathy, Ryan, E. Todd, Canaperi, Donald, Standaert, Theodore E., Spooner, Terry, Bonilla, Griselda, Edelstein, Daniel
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
Published in 2017 IEEE International Interconnect Technology Conference (IITC) (01.05.2017)
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Conference Proceeding
Geometry impact on the reduction of Cu interconnect wire resistance
Wei Wang, Spooner, Terry, Chih-Chao Yang, XunYuan Zhang
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
Nogami, Takeshi, Briggs, Benjamin D., Korkmaz, Sevim, Chae, Moosung, Penny, Christopher, Juntao Li, Wei Wang, McLaughlin, Paul S., Kane, Terence, Parks, Christopher, Madan, Anita, Cohen, Stephan, Shaw, Thomas, Priyadarshini, Deepika, Shobha, Hosadurga, Son Nguyen, Patlolla, Raghuveer, Kelly, James, Xunyuan Zhang, Spooner, Terry, Canaperi, Donald, Standaert, Theodorus, Huang, Elbert, Paruchuri, Vamsi, Edelstein, Daniel
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
Published in 2015 IEEE International Electron Devices Meeting (IEDM) (01.12.2015)
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Conference Proceeding
Journal Article
BEOL challenges for 14nm node and beyond
Taylor, B., Xuan Lin, Xunyuan Zhang, Hoon Kim, Ming He, Ryan, V.
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
Published in 2012 IEEE International Interconnect Technology Conference (01.06.2012)
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Conference Proceeding
Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications
Sun, Xiaoxuan, Peethala, Brown, Hopstaken, Marinus, Hu, Chao-kun, Mclaughlin, Paul S, van der Straten, O., Demarest, James, Motoyama, K., Nogami, Takeshi, Lin, Xuan, Zhang, Xunyuan, Kelly, James
Published in ECS transactions (01.08.2017)
Published in ECS transactions (01.08.2017)
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Journal Article