Covalent immobilization of glucose oxidase onto poly(styrene-co-glycidyl methacrylate) monodisperse fluorescent microspheres synthesized by dispersion polymerization
Hou, Xiaohui, Liu, Bailing, Deng, Xiaobo, Zhang, Baotan, Chen, Hualin, Luo, Rong
Published in Analytical biochemistry (01.09.2007)
Published in Analytical biochemistry (01.09.2007)
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Journal Article
Monodisperse polystyrene microspheres by dispersion copolymerization of styrene and other vinyl comonomers: Characterization and protein adsorption properties
Hou, Xiaohui, Liu, Bailing, Deng, Xiaobo, Zhang, Baotan, Yan, Jufang
Published in Journal of biomedical materials research. Part A (01.11.2007)
Published in Journal of biomedical materials research. Part A (01.11.2007)
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Journal Article
Covalent immobilization of glucose oxidase onto Poly(St-GMA-NaSS) monodisperse microspheres via BSA as spacer arm
Du, Tanxin, Liu, Bailing, Hou, Xiaohui, Zhang, Baotan, Du, Cuiming
Published in Applied surface science (30.06.2009)
Published in Applied surface science (30.06.2009)
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Journal Article
Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material
Ma, Jiake, Shang, Tianyu, Ren, Linlin, Yao, Yimin, Zhang, Tao, Xie, Jinqi, Zhang, Baotan, Zeng, Xiaoliang, Sun, Rong, Xu, Jian-Bin, Wong, Ching-Ping
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.01.2020)
Published in Chemical engineering journal (Lausanne, Switzerland : 1996) (15.01.2020)
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Journal Article
Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive
Jinze Li, Baotan Zhang, Pengli Zhu, Yuan Gao, Rong Sun
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
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Conference Proceeding
Liquid epoxy molding compound with high glass transition temperature and high thermal conductivity
Jinze Li, Baotan Zhang, Pengli Zhu, Gang Li, Rong Sun, Chingping Wong
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
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Conference Proceeding
Novel underfill material with low coefficient of thermal expansione
Baotan Zhang, Pengli Zhu, Gang Li, Rong Sun, Chingping Wong
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Preparation of highly conductive adhesives by insitu incorporation of silver nanoparticles
Yankang Han, Baotan Zhang, Pengli Zhu, Qianqian Liu, Yougen Hu, Rong Sun, Chingping Wong
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Silver flakes filled interpenetrating polymer network: High performance electrically conductive adhesives for electronic packaging
Yankang Han, Baotan Zhang, Pengli Zhu, Shulei Huang, Rong Sun, Chingping Wong
Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)
Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)
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Conference Proceeding
Cure kinetics study of a novel die attach adhesive for high power light-emitting diode
Baotan Zhang, Rong Sun, Yankang Han, Pengli Zhu, Daniel Lu, Daoqiang, Chingping Wong
Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)
Published in 2016 China Semiconductor Technology International Conference (CSTIC) (01.03.2016)
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Conference Proceeding
Design and Preparation of Ultra-Thin Conformal Shielding Coatings with Sandwich Structure for System in Packaging (SiP)
Zhang, Xuelong, Wu, Hao, Zhang, Baotan, Sun, Rong
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Complicated-trajectory Compartment EMI Shielding in SiP Modules by Dispensing Technology
Zhang, Xiaofei, Wu, Hao, Zhang, Baotan, Sun, Rong
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
Published in 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (08.08.2023)
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Conference Proceeding
A Comparative Study on the Influences of Various Nickel Powders on the EMI Shielding Performance of Conductive Polymer Composites
Wang, Yong, Tian, Dingkun, Xu, Yadong, Zhang, Baotan, Zhao, Tao, Hu, Yougen, Sun, Rong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic package
Chang, Hao, Zhang, Baotan, Zhu, Pengli, Sun, Rong, Wong, Chingping
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding