Stress modeling of Cu/low-k BEoL - application to stress migration
Zhai, C.J., Yao, H.W., Besser, P.R., Marathe, A., Blish, R.C., Erb, D., Hau-Riege, C., Taylor, S., Taylor, K.O.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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Conference Proceeding
Benefits and harms of drug treatment for type 2 diabetes: systematic review and network meta-analysis of randomised controlled trials
Shi, Qingyang, Nong, Kailei, Vandvik, Per Olav, Guyatt, Gordon H, Schnell, Oliver, Rydén, Lars, Marx, Nikolaus, Brosius, Frank C, Mustafa, Reem A, Agarwal, Arnav, Zou, Xinyu, Mao, Yunhe, Asadollahifar, Aminreza, Chowdhury, Saifur Rahman, Zhai, Chunjuan, Gupta, Sana, Gao, Ya, Lima, João Pedro, Numata, Kenji, Qiao, Zhi, Fan, Qinlin, Yang, Qinbo, Jin, Yinghui, Ge, Long, Yang, Qiuyu, Zhu, Hongfei, Yang, Fan, Chen, Zhe, Lu, Xi, He, Siyu, Chen, Xiangyang, Lyu, Xiafei, An, Xingxing, Chen, Yaolong, Hao, Qiukui, Standl, Eberhard, Siemieniuk, Reed, Agoritsas, Thomas, Tian, Haoming, Li, Sheyu
Published in BMJ (Online) (06.04.2023)
Published in BMJ (Online) (06.04.2023)
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Journal Article
Diagnostic value of combined application of GATA3, SOX10 and p16 in triple negative breast carcinomas
Zhang, D M, Zhai, C J, Feng, X D, Wang, C Z, Qiu, J F, Wei, J G
Published in Zhong hua yi xue za zhi (15.03.2022)
Published in Zhong hua yi xue za zhi (15.03.2022)
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Journal Article
Board level solder reliability versus ramp rate and dwell time during temperature cycling
Zhai, C.J., Sidharth, Blish, R.
Published in IEEE transactions on device and materials reliability (01.12.2003)
Published in IEEE transactions on device and materials reliability (01.12.2003)
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Magazine Article
Investigation and minimization of underfill delamination in flip chip packages
Zhai, C.J., Sidharth, Blish, R.C., Master, R.N.
Published in IEEE transactions on device and materials reliability (01.03.2004)
Published in IEEE transactions on device and materials reliability (01.03.2004)
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Magazine Article
Simulation and experiments of stress migration for Cu/low-k BEoL
Zhai, C.J., Yao, H.W., Marathe, A.P., Besser, P.R., Blish, R.C.
Published in IEEE transactions on device and materials reliability (01.09.2004)
Published in IEEE transactions on device and materials reliability (01.09.2004)
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Magazine Article
Design and process optimization for reliable resistor pack solder joints for microprocessor packages
Sidharth, S., Gannamani, R., Zhai, C.J., Blish, R.C., Master, R.N.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding