Simulation and experiments of stress migration for Cu/low-k BEoL
Zhai, C.J., Yao, H.W., Marathe, A.P., Besser, P.R., Blish, R.C.
Published in IEEE transactions on device and materials reliability (01.09.2004)
Published in IEEE transactions on device and materials reliability (01.09.2004)
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Magazine Article
Board level solder reliability versus ramp rate and dwell time during temperature cycling
Zhai, C.J., Sidharth, Blish, R.
Published in IEEE transactions on device and materials reliability (01.12.2003)
Published in IEEE transactions on device and materials reliability (01.12.2003)
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Magazine Article
Investigation and minimization of underfill delamination in flip chip packages
Zhai, C.J., Sidharth, Blish, R.C., Master, R.N.
Published in IEEE transactions on device and materials reliability (01.03.2004)
Published in IEEE transactions on device and materials reliability (01.03.2004)
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Magazine Article
Stress modeling of Cu/low-k BEoL - application to stress migration
Zhai, C.J., Yao, H.W., Besser, P.R., Marathe, A., Blish, R.C., Erb, D., Hau-Riege, C., Taylor, S., Taylor, K.O.
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
Published in 2004 IEEE International Reliability Physics Symposium. Proceedings (2004)
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Conference Proceeding
Investigation of Cu/low-k film delamination in flip chip packages
Zhai, C.J., Ozkan, U., Dubey, A., Sidharth, Blish, R.C., Master, R.N.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Reliability Modeling of Lidded Flip Chip Packages
Zhai, C.J., Too, S.S., Master, R.N.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Design and process optimization for reliable resistor pack solder joints for microprocessor packages
Sidharth, S., Gannamani, R., Zhai, C.J., Blish, R.C., Master, R.N.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding