Study of EMC for Cu Bonding Wire Application
Takeda, Toshiro, Seki, Hidetoshi, Itoh, Shingo, Zenbutsu, Shin-ichi
Published in ECS transactions (01.01.2011)
Published in ECS transactions (01.01.2011)
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Journal Article
An evaluation of effects of molding compound properties on reliability of Cu wire components
Peng Su, Seki, Hidetoshi, Chen Ping, Zenbutsu, Shin-ichi, Itoh, Shingo, Huang, Louie, Liao, Nicholas, Bill Liu, Chen, Curtis, Tai, Winnie, Tseng, Andy
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Study of EMC for Cu bonding wire application
Seki, Hidetoshi, Chen Ping, Nakatake, Hiroshi, Zenbutsu, Shin-ichi, Itoh, Shingo
Published in 2010 IEEE CPMT Symposium Japan (01.08.2010)
Published in 2010 IEEE CPMT Symposium Japan (01.08.2010)
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Conference Proceeding
An evaluation of effects of molding compound and substrate material properties on reliability of Cu wire BGA components
Peng Su, Seki, H., Nishitani, Y., Chen Ping, Zenbutsu, S., Itoh, Shingo, Huang, L., Liao, N., Liu, B., Chen, C., Tai, W., Tseng, A.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding