Interface mediated deformation and fracture of an elastic–plastic bimaterial system resolved by in situ transmission scanning electron microscopy
Alfreider, Markus, Balbus, Glenn, Wang, Fulin, Zechner, Johannes, Gianola, Daniel S., Kiener, Daniel
Published in Materials & design (01.11.2022)
Published in Materials & design (01.11.2022)
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Journal Article
Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics
Philippi, Bastian, Matoy, Kurt, Zechner, Johannes, Kirchlechner, Christoph, Dehm, Gerhard
Published in Scripta materialia (01.10.2016)
Published in Scripta materialia (01.10.2016)
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Journal Article
Electropolishing—A Practical Method for Accessing Voids in Metal Films for Analyses
Moser, Sebastian, Kleinbichler, Manuel, Kubicek, Sabine, Zechner, Johannes, Cordill, Megan J.
Published in Applied sciences (01.08.2021)
Published in Applied sciences (01.08.2021)
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Journal Article
Capturing the Dynamics of Ti Diffusion Across TixW1−x/Cu Heterostructures using X‐Ray Photoelectron Spectroscopy
Kalha, Curran, Thakur, Pardeep K., Lee, Tien‐Lin, Reisinger, Michael, Zechner, Johannes, Nelhiebel, Michael, Regoutz, Anna
Published in Advanced Physics Research (01.12.2023)
Published in Advanced Physics Research (01.12.2023)
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Journal Article
Microstructure and physical properties of sputter-deposited Cu-Mo thin films
Souli, Imane, Terziyska, Velislava L., Zechner, Johannes, Mitterer, Christian
Published in Thin solid films (01.05.2018)
Published in Thin solid films (01.05.2018)
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Journal Article
Closed-loop recyclability of a biomass-derived epoxy-amine thermoset by methanolysis
Wu, Xianyuan, Hartmann, Peter, Berne, Dimitri, De Bruyn, Mario, Cuminet, Florian, Wang, Zhiwen, Zechner, Johannes Matthias, Boese, Adrian Daniel, Placet, Vincent, Caillol, Sylvain, Barta, Katalin
Published in Science (American Association for the Advancement of Science) (12.04.2024)
Published in Science (American Association for the Advancement of Science) (12.04.2024)
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Journal Article
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films
Kleinbichler, Manuel, Kofler, Corinna, Stabentheiner, Manuel, Reisinger, Michael, Moser, Sebastian, Zechner, Johannes, Nelhiebel, Michael, Kozeschnik, Ernst
Published in Microelectronics and reliability (01.12.2021)
Published in Microelectronics and reliability (01.12.2021)
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Journal Article
Thermal stability of immiscible sputter-deposited Cu-Mo thin films
Souli, Imane, Gruber, Georg C., Terziyska, Velislava L., Zechner, Johannes, Mitterer, Christian
Published in Journal of alloys and compounds (30.04.2019)
Published in Journal of alloys and compounds (30.04.2019)
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Journal Article
Small-scale fracture toughness of ceramic thin films: the effects of specimen geometry, ion beam notching and high temperature on chromium nitride toughness evaluation
Best, James P., Zechner, Johannes, Wheeler, Jeffrey M., Schoeppner, Rachel, Morstein, Marcus, Michler, Johann
Published in Philosophical magazine (Abingdon, England) (01.12.2016)
Published in Philosophical magazine (Abingdon, England) (01.12.2016)
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Journal Article
Capturing the Dynamics of Ti Diffusion Across Ti x W 1−x /Cu Heterostructures using X‐Ray Photoelectron Spectroscopy
Kalha, Curran, Thakur, Pardeep K., Lee, Tien‐Lin, Reisinger, Michael, Zechner, Johannes, Nelhiebel, Michael, Regoutz, Anna
Published in Advanced Physics Research (01.12.2023)
Published in Advanced Physics Research (01.12.2023)
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Journal Article
Pulse electrodeposition of adherent nickel coatings onto anodized aluminium surfaces
Frantz, Cédric, Vichery, Charlotte, Zechner, Johannes, Frey, Damian, Bürki, Gerhard, Cebeci, Halil, Michler, Johann, Philippe, Laetitia
Published in Applied surface science (01.03.2015)
Published in Applied surface science (01.03.2015)
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Journal Article