Electromigration studies of lead-free solder balls used for wafer-level packaging
Hau-Riege, Christine, Zang, Ricky, You-Wen Yau, Yadav, Praveen, Keser, Beth, Jong-Kai Lin
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Reliability evaluation on low k wafer level packages
Yadav, P., Kalchuri, S., Keser, B., Zang, R., Schwarz, M., Stone, B.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Exploration of the design space of wafer level packaging through numerical simulation
Zhongping Bao, Burrell, J., Keser, B., Yadav, P., Kalchuri, S., Zang, Ricky
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Get full text
Conference Proceeding