Mechanical Design and Characterization for MEMS Thin-Film Packaging
Santagata, F., Zaal, J. J. M., Huerta, V. G., Mele, L., Creemer, J. F., Sarro, P. M.
Published in Journal of microelectromechanical systems (01.02.2012)
Published in Journal of microelectromechanical systems (01.02.2012)
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Journal Article
Challenges in the assembly and handling of thin film capped MEMS devices
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Journal Article
Book Review
Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps
Inamdar, Adwait, Thukral, Varun, Zhang, Letian, Zaal, Jeroen J. M., Van Soestbergen, Michiel, Tuinhout, Hans, Van Driel, Willem D., Zhang, GuoQi
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Test Structures for studying the impact of the backend contact metallization on the performance and stress sensitivity of SiGe HBTs
Dieball, Oliver, Tuinhout, Hans, Zaal, Jeroen
Published in 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) (15.04.2024)
Published in 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS) (15.04.2024)
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Conference Proceeding
A New Type Low Cost Sandwiched Power Package Structure and its Manufacturing
Ge, Garry, Lye, Gideon, Wang, Sonder, Zaal, Jeroen
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications
Thukral, Varun, Bacquet, Irene, Van Soestbergen, Michiel, Zaal, Jeroen, Roucou, Romuald, Rongen, Rene, Van Driel, Willem D., Zhang, GuoQi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Patterned and planarized under-bump metallization
Liu, Yufu, Southworth, Paul, Zaal, Jeroen Johannes Maria, Ng, Cheong Chiang, Hayes, Scott M, Kanth, Namrata, Daniels, Dwight Lee
Year of Publication 15.10.2024
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Year of Publication 15.10.2024
Patent
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
Liu, Yufu, Southworth, Paul, Zaal, Jeroen Johannes Maria, Ng, Cheong Chiang, Hayes, Scott M, Kanth, Namrata, Daniels, Dwight Lee
Year of Publication 23.11.2023
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Year of Publication 23.11.2023
Patent
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
ZAAL, Jeroen Johannes Maria, KANTH, Namrata, DANIELS, Dwight Lee, SOUTHWORTH, Paul, NG, Cheong Chiang, HAYES, Scott M, LIU, Yufu
Year of Publication 22.11.2023
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Year of Publication 22.11.2023
Patent
Effective Stress Relief Without Jeopardizing Reliability in Overmolded Packages with Stress Buffers
Mavinkurve, A., Zaal, Jeroen, Liang, Yukai, Xu, Sean, Storez, Antoine, Guo, Yuan, Teng, Seng, Chopin, Sheila
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Multi-die array device
Zaal, Jeroen Johannes Maria, Mavinkurve, Amar Ashok, Janssen, Johannes Henricus Johanna, Kamphuis, Antonius Hendrikus Jozef
Year of Publication 01.10.2019
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Year of Publication 01.10.2019
Patent
MULTI-DIE ARRAY DEVICE
KAMPHUIS, Antonius Hendrikus Jozef, ZAAL, Jeroen Johannes Maria, JANSSEN, Johannes Henricus Johanna, MAVINKURVE, Amar Ashok
Year of Publication 20.06.2019
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Year of Publication 20.06.2019
Patent