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Michaud, L G, Castan, C, Zussy, M, Montméat, P, Mareau, V H, Gonon, L, Fournel, F, Rieutord, F, Tardif, S
Published in Nanotechnology (03.04.2020)
Published in Nanotechnology (03.04.2020)
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Heterogeneous integration of microdisk lasers on silicon strip waveguides for optical interconnects
Hattori, H.T., Seassal, C., Touraille, E., Rojo-Romeo, P., Letartre, X., Hollinger, G., Viktorovitch, P., Di Cioccio, L., Zussy, M., Melhaoui, L.E., Fedeli, J.M.
Published in IEEE photonics technology letters (01.01.2006)
Published in IEEE photonics technology letters (01.01.2006)
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3D harnessing of light with 2.5D photonic crystals
Viktorovitch, P., Ben Bakir, B., Boutami, S., Leclercq, J. Louis, Letartre, X., Rojo-Romeo, P., Seassal, C., Zussy, M., Di Cioccio, L., Fedeli, J.Marc
Published in Laser & photonics reviews (28.04.2010)
Published in Laser & photonics reviews (28.04.2010)
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InP dies transferred onto silicon substrate for optical interconnects application
Kostrzewa, M., Di Cioccio, L., Zussy, M., Roussin, J.C., Fedeli, J.M., Kernevez, N., Regreny, P., Lagahe-Blanchard, Ch, Aspar, B.
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Published in Sensors and actuators. A. Physical. (01.01.2006)
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Transfers of 2-inch GaN films onto sapphire substrates using Smart Cut technology
TAUZIN, A, AKATSU, T, GARRIONE, J, FAURE, B, LETERTRE, F, KEMEVEZ, N, RABAROT, M, DECHAMP, J, ZUSSY, M, MORICEAU, H, MICHAUD, J. F, CHARVET, A. M, DI CIOCCIO, L, FOUMEL, F
Published in Electronics letters (26.05.2005)
Published in Electronics letters (26.05.2005)
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3-inch single-crystal LiTaO3 films onto metallic electrode using Smart Cut™ technology
TAUZIN, A, DECHAMP, J, YOSHIMI, M, RIGNY, A, MADEIRA, F, MAZEN, F, ZUSSY, M, DEGUET, C, CLAVELIER, L, MOULET, J.-S, RICHTARCH, C, AKATSU, T
Published in Electronics letters (19.06.2008)
Published in Electronics letters (19.06.2008)
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3-inch single-crystal LiTaO3 films onto metallic electrode using Smart CutTM technology
Tauzin, A., Dechamp, J., Madeira, F., Mazen, F., Zussy, M., Deguet, C., Clavelier, L., Moulet, J.-S., Richtarch, C., Akatsu, T., Yoshimi, M., Rigny, A.
Published in Electronics letters (2008)
Published in Electronics letters (2008)
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Chip-to-chip interconnections based on the wireless capacitive coupling for 3D integration
Charlet, B., Di Cioccio, L., Dechamp, J., Zussy, M., Enot, T., Canegallo, R., Fazzi, A., Guerrieri, R., Magagni, L.
Published in Microelectronic engineering (01.11.2006)
Published in Microelectronic engineering (01.11.2006)
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Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development
Bourjot, E., Stewart, P., Dubarry, C., Lagoutte, E., Rolland, E., Bresson, N., Romano, G., Scevola, D., Balan, V., Dechamp, J., Zussy, M., Mauguen, G., Castan, C., Sanchez, L., Jouve, A., Fournel, F., Cheramy, S.
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
Published in 2019 International 3D Systems Integration Conference (3DIC) (01.10.2019)
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Conference Proceeding
Transfers of 2-inch GaN films onto sapphire substrates using Smart CutTM technology
Tauzin, A., Akatsu, T., Rabarot, M., Dechamp, J., Zussy, M., Moriceau, H., Michaud, J.F., Charvet, A.M., Di Cioccio, L., Fournel, F., Garrione, J., Faure, B., Letertre, F., Kernevez, N.
Published in Electronics letters (2005)
Published in Electronics letters (2005)
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Origin of the TTV of thin films obtained by temporary bonding ZoneBond® technology
Montméat, P., Enot, T., Pellat, M., Fournel, F., Bally, L., Baud, L., Dechamp, J., Eleouet, R., Vignoud, L., Zussy, M.
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2015)
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2015)
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Direct bonding for silicon photonics
Augendre, E, Fedeli, J.-M, Bordel, D, Ben Bakir, B, Kopp, C, Grenouillet, L, Hartmann, J.-M, Harduin, J, Philippe, P, Olivier, N, Fournier, M, Zussy, M, Lefebvre, K, Sturm, J, Di Cioccio, L, Fulbert, L, Clavelier, L
Published in 2010 Photonics Global Conference (01.12.2010)
Published in 2010 Photonics Global Conference (01.12.2010)
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Conference Proceeding
Room-temperature InAs/InP Quantum Dots laser operation based on heterogeneous "2.5 D" Photonic Crystal
Ben Bakir, Badhise, Seassal, Christian, Letartre, Xavier, Regreny, Philippe, Gendry, Michel, Viktorovitch, Pierre, Zussy, Marc, Di Cioccio, Léa, Fedeli, Jean-Marc
Published in Optics express (02.10.2006)
Published in Optics express (02.10.2006)
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3-inch single-crystal LiTaO^sub 3^ films onto metallic electrode using Smart Cut^sup TM^ technology
Tauzin, A, Dechamp, J, Madeira, F, Mazen, F, Zussy, M, Deguet, C, Clavelier, L, Moulet, J-S, Richtarch, C, Akatsu, T, Yoshimi, M, Rigny, A
Published in Electronics letters (19.06.2008)
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Published in Electronics letters (19.06.2008)
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3-inch single-crystal LiTaO sub( 3) films onto metallic electrode using Smart Cut super( TM) technology
Tauzin, A, Dechamp, J, Madeira, F, Mazen, F, Zussy, M, Deguet, C, Clavelier, L, Moulet, J-S, Richtarch, C, Akatsu, T, Yoshimi, M, Rigny, A
Published in Electronics letters (01.06.2008)
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Published in Electronics letters (01.06.2008)
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Coupling analysis of heterogeneous integrated InP based photonic crystal triangular lattice band-edge lasers and silicon waveguides
Hattori, Haroldo, Seassal, Christian, Letartre, Xavier, Rojo-Romeo, Pedro, Leclercq, Jean, Viktorovitch, Pierre, Zussy, Marc, di Cioccio, Lea, El Melhaoui, Loubna, Fedeli, Jean-Marc
Published in Optics express (02.05.2005)
Published in Optics express (02.05.2005)
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Journal Article
Room-temperature InAs/InP Quantum Dots laser operation based on heterogeneous “2.5 D” Photonic Crystal
Ben Bakir, B., Seassal, C, Letartre, X., Regreny, Philippe, Gendry, Michel, Viktorovitch, P., Zussy, M, Cioccio, L Di, Fedeli, J M
Published in Optics express (02.10.2006)
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Published in Optics express (02.10.2006)
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Challenges and Progress in Germanium-on-Insulator Materials and Device Development towards ULSI Integration
Augendre, Emmanuel, Sanchez, Loïc, Benaissa, Lamine, Signamarcheix, Thomas, Hartmann, Jean-Michel, Le Royer, Cyrille, Vinet, Maud, Van Den Daele, William, Damlencourt, Jean-François, Romanjek, Krunoslav, Pouydebasque, Arnaud, Batude, Perrine, Tabone, Claude, Mazen, Frédéric, Tauzin, Aurélie, Blanc, Nicolas, Pellat, Michel, Dechamp, Jérôme, Zussy, Marc, Scheiblin, Pascal, Jaud, Marie-Anne, Drazek, Charlotte, Maurois, Cécile, Piccin, Matteo, Abbadie, Alexandra, Lallement, Fabrice, Daval, Nicolas, Guiot, Eric, Rigny, Arnaud, Ghyselen, Bruno, Bourdelle, Konstantin, Boulanger, Fabien, Cristoloveanu, Sorin, Billon, Thierry, Faynot, Olivier, Deguet, Chrystel, Clavelier, Laurent
Published in ECS transactions (01.01.2009)
Published in ECS transactions (01.01.2009)
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Transfers of 2-inch GaN films onto sapphire substrates using Smart Cut(TM) technology
Tauzin, A, Akatsu, T, Rabarot, M, Dechamp, J, Zussy, M, Moriceau, H, Michaud, J F, Charvet, A M, Di Cioccio, L, Fournel, F, Garrione, J, Faure, B, Letertre, F, Kernevez, N
Published in Electronics letters (26.05.2005)
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Published in Electronics letters (26.05.2005)
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